SNVU768 December   2021 LM63440-Q1 , LM63460-Q1 , LM64440-Q1 , LM64460-Q1

 

  1.   Trademarks
  2. 1High-Density EVM Description
    1. 1.1 Typical Applications
    2. 1.2 Features and Electrical Performance
  3. 2EVM Performance Specifications
  4. 3EVM Photo
  5. 4Test Setup and Procedure
    1. 4.1 EVM Connections
    2. 4.2 EVM Setup
    3. 4.3 Test Equipment
    4. 4.4 Recommended Test Setup
      1. 4.4.1 Input Connections
      2. 4.4.2 Output Connections
    5. 4.5 Test Procedure
      1. 4.5.1 Line/Load Regulation and Efficiency
  6. 5Test Data and Performance Curves
    1. 5.1 Conversion Efficiency
    2. 5.2 Output Voltage Regulation
    3. 5.3 Operating Waveforms
      1. 5.3.1 Start-Up and Enable ON/OFF
      2. 5.3.2 Line and Load Transients
      3. 5.3.3 Short Circuit and Recovery
    4. 5.4 Thermal Performance
    5. 5.5 EMI Results – CISPR 25 Class 5
      1. 5.5.1 Conducted EMI
      2. 5.5.2 Radiated EMI
  7. 6EVM Documentation
    1. 6.1 Schematics
      1. 6.1.1 LM63460EVM-2MHZ Schematic
      2. 6.1.2 LM64460EVM-2MHZ Schematic
    2. 6.2 Bill of Materials
      1. 6.2.1 Alternative BOM Configurations
    3. 6.3 PCB Layout
    4. 6.4 Assembly Drawings
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Custom Design With WEBENCH® Tools
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation

3 EVM Photo

Figure 3-1 highlights the buck converter power stage and the various connection interfaces associated with the EVM. Use terminal blocks J1 and J2 to connect the input supply and load, respectively. These terminal blocks accept up to 16-AWG wire thickness.

Figure 3-1 BSR173 EVM Photo
GUID-B5F70B40-D946-48A4-8F46-18A24BA14C02-low.gif
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