SNVU768 December   2021 LM63440-Q1 , LM63460-Q1 , LM64440-Q1 , LM64460-Q1

 

  1.   Trademarks
  2. 1High-Density EVM Description
    1. 1.1 Typical Applications
    2. 1.2 Features and Electrical Performance
  3. 2EVM Performance Specifications
  4. 3EVM Photo
  5. 4Test Setup and Procedure
    1. 4.1 EVM Connections
    2. 4.2 EVM Setup
    3. 4.3 Test Equipment
    4. 4.4 Recommended Test Setup
      1. 4.4.1 Input Connections
      2. 4.4.2 Output Connections
    5. 4.5 Test Procedure
      1. 4.5.1 Line/Load Regulation and Efficiency
  6. 5Test Data and Performance Curves
    1. 5.1 Conversion Efficiency
    2. 5.2 Output Voltage Regulation
    3. 5.3 Operating Waveforms
      1. 5.3.1 Start-Up and Enable ON/OFF
      2. 5.3.2 Line and Load Transients
      3. 5.3.3 Short Circuit and Recovery
    4. 5.4 Thermal Performance
    5. 5.5 EMI Results – CISPR 25 Class 5
      1. 5.5.1 Conducted EMI
      2. 5.5.2 Radiated EMI
  7. 6EVM Documentation
    1. 6.1 Schematics
      1. 6.1.1 LM63460EVM-2MHZ Schematic
      2. 6.1.2 LM64460EVM-2MHZ Schematic
    2. 6.2 Bill of Materials
      1. 6.2.1 Alternative BOM Configurations
    3. 6.3 PCB Layout
    4. 6.4 Assembly Drawings
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Custom Design With WEBENCH® Tools
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation

6.3 PCB Layout

Figure 6-3 through Figure 6-8 show the board layout. The design offers appropriate test points to configure the following:

  • PGOOD monitor
  • Precision enable and input voltage UVLO
  • Bode plot measurement
  • External clock synchronization

The 22-pin Enhanced HotRod package enables a very small solution size and a low-EMI design. The PCB consists of a 4-layer design with 2-oz copper on all layers and an array of thermal vias to connect to all four layers. Input and output connectors with adjacent sense points for the supply and load enable a convenient setup to power the EVM, measure efficiency, and so forth.

Figure 6-3 Top 3D View
Figure 6-4 Bottom 3D View (viewed from Bottom)
Figure 6-5 Top Layer
Figure 6-6 Layer 2
Figure 6-7 Layer 3
Figure 6-8 Bottom Layer
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