SNVU792 September   2021 LM5152-Q1

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Applications
    2. 1.2 Features
  3. 2EVM Setup
    1. 2.1 EVM Characteristics
    2. 2.2 EVM Connectors and Test Points
  4. 3Test Setup and Procedures
    1. 3.1 Equipment
  5. 4Test Results
    1. 4.1 Efficiency
    2. 4.2 Loop Response
    3. 4.3 Thermal Performance
    4. 4.4 Typical Waveforms
  6. 5PCB Layers
  7. 6Schematic
  8. 7Bill of Materials

PCB Layers

Figure 5-1 through Figure 5-6 illustrate the EVM PCB layout.

GUID-20210820-SS0I-1RJZ-WD0H-DZ10HPN9CZ3K-low.gifFigure 5-1 Layout: Top Silk Screen
GUID-20210820-SS0I-MZS1-P8GC-DQP9H6SSMTMQ-low.gifFigure 5-3 Layout: Signal Layer 1
GUID-20210820-SS0I-PWQD-SGQ1-H2KSJX1BT28G-low.gifFigure 5-5 Layout: Bottom Layer
GUID-20210820-SS0I-2SQQ-DJ8M-BMRLLFNW9D61-low.gifFigure 5-2 Layout: Top Layer
GUID-20210820-SS0I-B3FG-C55Z-NT1GM8RF1LHN-low.gifFigure 5-4 Layout: Signal Layer 2
GUID-20210820-SS0I-PDJF-BXXJ-RB1GNN4CKXDL-low.gifFigure 5-6 Layout: Bottom Silk Screen