5 PCB Layout

Figure 5-1 through Figure 5-4 show the board layout for the LM5168FEVM.

The 8-pin SO PowerPAD™ package offers an exposed thermal pad, which must be soldered to the copper landing on the PCB for optimal thermal performance. The PCB consists of a 4-layer design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal vias under the thermal pad to connect to all four layers.

Figure 5-1 Top Layer

Figure 5-2 Mid-Layer 1 Ground Plane

Figure 5-3 Mid-Layer 2 Routing

Figure 5-4 Bottom Layer