SNVU928 November   2024 LMR66430-EP

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 EVM Specifications
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 Test Points
      2. 2.1.2 Jumpers
    2. 2.2 Operation: Quick Start
  8. 3Implementation Results
    1. 3.1 LMR66430NEP-EVM Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks

LMR66430NEP-EVM Thermal Performance

The LMR66430NEP-EVM was evaluated with a 24V input with a resistive load. The following figures demonstrate the case temperature rise from room temperature (25°C) on the EVM. These figures give a good approximation of the junction temperature with the temperature gradient being very small across the thin case and junction.
LMR66430NEP-EVM Thermal Capture,
          24VIN, 3.3VOUT, 1MHz, 2A Figure 3-1 Thermal Capture, 24VIN, 3.3VOUT, 1MHz, 2A
LMR66430NEP-EVM Thermal Capture,
          24VIN, 3.3VOUT, 1MHz, 3A Figure 3-2 Thermal Capture, 24VIN, 3.3VOUT, 1MHz, 3A