SPMZ864 march 2023 TM4C123BH6ZRB , TM4C123GH6ZRB

1 Package Redesign Details

Explanation

The devices in the MicroStar Junior™ BGA packaging were redesigned using a laminate nfBGA package. This nfBGA package offers data sheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Junior BGA. For more details, please refer to this nfBGA Packaging Application Report.

When referencing the device data sheet, use the new package designator in place of the discontinued package designator throughout the document.

The orderable addendum at the end of the device data sheet will reflect the new package designator.

See the following page or the end of the device data sheet for the updated nfBGA package drawing.

Table 1-1 Package Designator

Old Package Designator	New Package Designator
ZRB	NMR

Reason for Discontinuance

Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA™ and MicroStar Junior BGA packaging devices and offering a Last Time Buy.

These devices have now been converted to an nfBGA package.

Devices Affected

The following table describes the devices affected, the old and new package designators, and references to the device data sheet.

Table 1-2 Devices and Nomenclature

Device	Discontinued MicroStar Junior BGA Device⁽¹⁾	Redesigned Laminate nfBGA Device⁽¹⁾	Device Data Sheet
TM4C123BH6x	TM4C123BH6ZRBI	TM4C123BH6NMRI	SPMS370
	TM4C123BH6ZRBI7	TM4C123BH6NMRI7
	TM4C123BH6ZRBI7R	TM4C123BH6NMRI7R
	TM4C123BH6ZRBIR	TM4C123BH6NMRIR
TM4C123GH6x	TM4C123GH6ZRBI	TM4C123GH6NMRI	SPMS378
	TM4C123GH6ZRBI7	TM4C123GH6NMRI7
	TM4C123GH6ZRBI7R	TM4C123GH6NMRI7R
	TM4C123GH6ZRBIR	TM4C123GH6NMRIR
	TM4C123GH6ZRBT	TM4C123GH6NMRT
	TM4C123GH6ZRBT7	TM4C123GH6NMRT7
	TM4C123GH6ZRBT7R	TM4C123GH6NMRT7R

(1) Discontinued and redesigned devices are pin-for-pin compatible.