7 Limitations of This Document

• Not all TI’s embedded products support a 10 year and 105°C T_J useful life. Devices with limited POH/useful life will specifiy this in their device-specific data sheets.
• The reliability discussed in this document is limited to semiconductor reliability under power on conditions only (silicon lifetime). It does not include assessment of package reliability conditions, which needs separate reliability assessments.
• Data retention periods of non-volatile memory are not considered in this application report. For more information regarding these values, see the device-specific data sheets.
• For devices using 28 nm and newer process technologies, there are additional use case conditions that must be factored into the POH assessments beyond what is included in the published data sheet. For more information, contact your local TI representative.