SPRACK9 February   2019 AM1705 , AM1707 , AM1806 , AM1808 , OMAP-L132 , OMAP-L137 , OMAP-L138 , TMS320C6742 , TMS320C6745 , TMS320C6746 , TMS320C6747 , TMS320C6748

 

  1.   OMAP-L13x/C674x/AM1x schematic review guidelines
    1.     Trademarks
    2. 1 Introduction
    3. 2 Recommendations Specific to OMAP-L1x/TMS320C674x/AM1x
      1. 2.1 EVM vs Data Sheet
      2. 2.2 Before You Begin
        1. 2.2.1 Documentation
        2. 2.2.2 Pinout
      3. 2.3 Critical Connections
        1. 2.3.1 Decoupling capacitors
        2. 2.3.2 Power
        3. 2.3.3 Ground
        4. 2.3.4 Clocking
        5. 2.3.5 Reset
        6. 2.3.6 Boot
        7. 2.3.7 Pin multiplexing
        8. 2.3.8 Debug
      4. 2.4 Peripherals
        1. 2.4.1 UART
        2. 2.4.2 EMAC
        3. 2.4.3 MMC/SD
        4. 2.4.4 EMIF
          1. 2.4.4.1 NAND
          2. 2.4.4.2 NOR
          3. 2.4.4.3 DDR2/mDDR
        5. 2.4.5 SPI
        6. 2.4.6 I2C
        7. 2.4.7 McASP
          1. 2.4.7.1 Audio
        8. 2.4.8 USB
          1. 2.4.8.1 USB0 (USB 2.0 OTG)
          2. 2.4.8.2 USB1 (USB 1.1 OHCI)
          3. 2.4.8.3 Unused USB pins
          4. 2.4.8.4 USB Board Design Guidelines
            1. 2.4.8.4.1 Cautionary note - USB PHY off while host is still powered on
        9. 2.4.9 Other
          1. 2.4.9.1 Signal Visibility
          2. 2.4.9.2 Voltage Level Changes
          3. 2.4.9.3 Signal Terminations
          4. 2.4.9.4 Ground Symbols
          5. 2.4.9.5 Power Symbols
    4. 3 BGA PCB Design
    5. 4 Power Management Solutions
    6. 5 References
  2.   A XDS Connector Design Checklist
    1.     A.1 XDS Connector Design
  3.   B Connecting NOR Flash to OMAP-L138
    1.     B.1 Connecting Memory Devices <32 MB
    2.     B.2 Connecting Memory Devices >32 MB

Audio

  • Filter audio power rails.
  • Audio ground should be single-point. This is accomplished by separating (and using different symbols for) digital and analog grounds on the schematic and then connecting them together with a 0 ohm resistor or ferrite bead in the schematic. This ensures that all audio grounds are connected to digital ground at only one point, thereby reducing the chance of ground loops.