SPRACY2 May 2021 TMUX646
The thermal modeling process outlined in the Solder Ball Collapse image in nFBGA Packaging is applicable to both standard and small body nFBGAs. The results for some of TI’s smaller nFBGA packages are listed in Table 4-1.
| Package | ZEC | ZWA | NMN | NME |
|---|---|---|---|---|
| DieSize (mm) | 1.565 x0.800 | 0.998 x0.628 | 1.468 x0.926 | 1.834 x1.88 |
| ϴJA (°C/W) | 111.7 | 181.4 | 134.3 | 131.4 |
| ϴJC (°C/W) | 49.2 | 136.7 | 90.7 | 56.5 |