SPRACY2 May 2021 TMUX646
There is little difference between the structure of TIs standard and small body nFBGAs. However, small body nFBGA are subjected to rigorous reliability testing to ensure that the minor design differences do not impact reliability, especially BLR. Table 5-1 shows some of the BLR temperature cycle results for some of TI’s small body nFBGA packages
| Conditions (With Solder Paste) | Failures/Sample Size | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Requirements | Extended Range | |||||||||||
| Package | TI Mfg. Site | Body | Pitch | Die | Temp. | 500 | 800 | 1000 | 1500 | 2000 | 2500 | 3000 |
| Test Site | (mm) | (mm) | (mm) | Cycle (°C) |
(Cycles) | (Cycles) | ||||||
| ZWA 11 balls | TIPI | 2 x 1.4 | 0.5 | 1.0x0.6 | -40/85 | 0/33 | 0/33 | 0/33 | 0/33 | 0/33 | 0/33 | 0/33 |
| ZEC 36 balls | TIPI | 2.45 x 2.45 | 0.4 | 1.6x0.8 | -40/125 | TBD | TBD | TBD | TBD | TBD | TBD | TBD |