SPRAD13 May 2022 AM623 , AM625
The AM62x Via channel array solution has been designed to support the following. AM62x package supports similar feature set as several other competition solutions with approx. 15% smaller package area and ~10% wider line width. This solution therefore, reduces PCB foot print and utilizes lower cost PCB rules enabling compact and low-cost systems.
| PCB Feature | PCB Routing Requirements |
|---|---|
| Minimum via diameter | 18 mils |
| Via hole size | 10 mils (0.25mm) |
| Minimum trace width/spacing required in the BGA break out | 3.2mil / 3.2mil |
| Number of layers used for escape | 3 |
| BGA land pad size | 0.25mm via (typical) |
| Package Size | 13mm x 13mm, 0.5mm pitch w/ VCA |
| PCB layers (signal routing, total) recommended | 2, 6 |