SPRAD64 November   2022 AM620-Q1 , AM623 , AM625 , AM625-Q1

 

  1.   Trademarks
  2. Introduction
  3. Width/Spacing Proposal for Escapes
  4. Stackup
  5. Via Sharing
  6. Floorplan Component Placement
  7. Critical Interfaces Impact Placement
  8. Routing Priority
  9. SerDes Interfaces
  10. DDR Interfaces
  11. 10Power Decoupling
  12. 11Route Lowest Priority Interfaces Last
  13. 12Summary

Via Sharing

The FC-BGA pattern implemented on the AM62x (AMC) design offers several opportunities for via sharing. Vias are shared across BGA pins. Figure 4-1 and Figure 4-2 show the via sharing opportunities for VDD_CORE and VSS power supplies respectively. Further opportunities for other power domains are illustrated in Figure 4-3. Via sharing across BGA pins provides for easier escape routing and also robust electrical connection by connecting multiple pins.

GUID-57AD266B-FF29-40E9-AB73-2CB58580491D-low.png Figure 4-1 Via Sharing for VDD_CORE Domain
GUID-F0F11CB4-99B0-468C-AD1F-27F025196498-low.png Figure 4-2 Via Sharing for VSS
GUID-C1E63433-46CA-4853-A832-35AA95F367B3-low.png Figure 4-3 Via Sharing for Other Power Domains