Information redundancy techniques can be applied via software as an additional runtime diagnostic. In order to provide diagnostic coverage for network elements outside the C2000 MCU (wiring harness, connectors, transceiver) end-to-end safety mechanisms are applied. These mechanisms can also provide diagnostic coverage inside the C2000 MCU.

In the case of processing elements (CPU and CLA), this refers to multiple executions of the code and software based cross checking to ensure correctness. The multiple execution and result comparison may be based on either the same code executed multiple times or diversified software code implemented. For details regarding the implementation, see the ISO 26262-5, D.2.3.4. In the case of DMA, this refers to an addition of information (SECDED codes, Parity codes, CRC, and so forth) to data (payload), enabling data consistency check at the receiver side.

In the case of DMA and EMIF, this refers to the addition of information (SECDED codes, Parity codes, CRC, and so forth) to data (payload), enabling data consistency check at the receiver side.

Typical control applications involve measuring three phase the voltage and current. These values are either sampled directly using the on chip ADC or send to the TMS320F2837xD/S and TMS320F2807x MCU by the sensors which are captured using ECAP, SDFM, and so forth. In such scenarios, the correlation between input signals can be used to check the integrity (for example, if the three phase voltage, V1, V2, V3 is being measured, the function V₁ + V₂ + V₃ = 0 can be used to provide diagnostic coverage for input signal integrity).

In the case of SRAM and FLASH memory, critical data, program, variables, and so forth can be stored redundantly and compared before it is getting used. Care should be taken to avoid compiler optimizing code containing redundant data/programs.