SPRUIM6A October   2018  – November 2020

 

  1. 1Introduction
    1. 1.1 Key Features
  2. 2AM65x IDK Overview
  3. 3Common Processor Board
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Overview of Common Processor Board
      1. 3.3.1  Clocking
        1. 3.3.1.1 RTC Clock
        2. 3.3.1.2 Maxwell SoC Clock
        3. 3.3.1.3 Ethernet PHY Clocks
        4. 3.3.1.4 SERDES Clock
      2. 3.3.2  Reset
      3. 3.3.3  Power Requirements
        1. 3.3.3.1 Power Input
        2. 3.3.3.2 Overvoltage and Undervoltage Protection Circuit
        3. 3.3.3.3 Voltage Supervisor
        4. 3.3.3.4 Current Monitoring
        5. 3.3.3.5 Power Supply
        6. 3.3.3.6 Power Sequencing
        7. 3.3.3.7 SoC Power
      4. 3.3.4  Configuration
        1. 3.3.4.1 Boot Modes
        2. 3.3.4.2 JTAG
          1. 3.3.4.2.1 Test Automation
        3. 3.3.4.3 UART Interface
      5. 3.3.5  Memory Interfaces
        1. 3.3.5.1 DDR4 Interface
        2. 3.3.5.2 MMC Interface
          1. 3.3.5.2.1 SDHC Interface
          2. 3.3.5.2.2 eMMC Interface
        3. 3.3.5.3 OSPI Interface
        4. 3.3.5.4 SPI NOR Flash Interface
        5. 3.3.5.5 Board ID EEPROM Interface
        6. 3.3.5.6 Boot EEPROM Interface
      6. 3.3.6  Ethernet Interface
        1. 3.3.6.1 Gigabit Ethernet PHY Default Configuration
        2. 3.3.6.2 Ethernet LEDs
      7. 3.3.7  LCD Display Interface
      8. 3.3.8  USB 2.0 Interface
      9. 3.3.9  CSI-2 Interface
      10. 3.3.10 Application Card Interface
      11. 3.3.11 SERDES Interface
      12. 3.3.12 GPMC/DSS Interface
      13. 3.3.13 I2C Interface
      14. 3.3.14 SPI Interface
      15. 3.3.15 Timer and Interrupt
        1. 3.3.15.1 Timer
        2. 3.3.15.2 Interrupt
      16. 3.3.16 Fan Connector
  4. 4IDK Application Card
    1. 4.1 Key Features
    2. 4.2 Overview of IDK Application Board
      1. 4.2.1 Application Card Connector
      2. 4.2.2 Profibus Interface
      3. 4.2.3 CAN Interface
      4. 4.2.4 Rotary Switch
      5. 4.2.5 Industrial I/O Terminal Connector
      6. 4.2.6 Ethernet Interface
      7. 4.2.7 Board ID Memory
      8. 4.2.8 Power Supply
  5. 5x2 Lane PCIe Personality Card
    1. 5.1 Key Features
    2. 5.2 Overview of PCIex2 Daughter Card
      1. 5.2.1 Personality Card Connectors
      2. 5.2.2 USB 2.0 Interface
      3. 5.2.3 PCIe Interface
      4. 5.2.4 x2 Lane PCIe Personality Card Clocking
      5. 5.2.5 Board ID EEPROM Interface
      6. 5.2.6 x2 Lane PCIe Personality Card Power
  6. 6Known Issues
    1. 6.1 Determining the Revision and Date Code for the EVM
    2. 6.2 Known Issues for the A, E4, and E3 Revision
      1. 6.2.1 Lack of Reset for I2C IO Expander
    3. 6.3 Known Issues for the E4 & E3 Revision
      1. 6.3.1 Changes Unique to the E4 Revision Modified for 2.0 Revision
    4. 6.4 Known Issues for the E3 Revision
      1. 6.4.1 Resonance Observed on the SoC Side of Some Filters Associated with VDDA_1V8
      2. 6.4.2 Additional LDO Power Supply Needed for VDDA_1P8_SERDES0
      3. 6.4.3 Length of the RESET Signal to the PCIE Connectors on the SERDES Daughter Card
      4. 6.4.4 The PORz_OUT and MCU_PORz_OUT Signals Go High During Power Sequencing
      5. 6.4.5 Orientation of the Current Monitoring Shunt Resistors
      6. 6.4.6 SD Card IO Supply Capacitance
      7. 6.4.7 PHY Resistor Strapping Changed to Disable EEE Mode
      8. 6.4.8 The I2C Address for the I2C Boot Memory changed to 0x52
  7. 7Configuring the PRG0 and PRG1 Ethernet Interface to MII
    1. 7.1 Ethernet PHY Initial Conditions and TX Clock Signal Change
      1. 7.1.1 Ethernet PHY0 Clock and Initial Condition for MII
      2. 7.1.2 Ethernet PHY1 Clock and Initial Condition for MII
      3. 7.1.3 Ethernet PHY2 Clock and Initial Condition for MII
      4. 7.1.4 Ethernet PHY3 Clock and Initial Condition for MII
    2. 7.2 Ethernet PHY and TX Data Signals Change
      1. 7.2.1 Ethernet PHY0 TX Data Signals for MII
      2. 7.2.2 Ethernet PHY1 TX Data Signals for MII
      3. 7.2.3 Ethernet PHY2 TX Data Signals for MII
      4. 7.2.4 Ethernet PHY3 TX Data Signals for MII
  8. 8Revision History

3.3.14 SPI Interface

Of the six SPI interfaces supported by the AM65x processor, three are used on the processor card:

  • SPI0: A 128-Mbit SPI NOR Flash of part number MT25QL128ABA8E12 is interfaced to the SPI0 port of the AM65x. In addition, SPI0 is also connected to the application connector. SPI_CS0 and SPI_CS1 chip select signals are used for the serial flash and application connector, respectively.
  • SPI1 is connected to the display connector, GPMC/DSS connector, and test header. The SPI1 interface signals are at a 3.3-V I/O level. SPI1_CS0 is connected to the display connector and SPI_CS1 is connected to the GPMC/DSS connector. The chip selects SPI1_CS0 and SPI_CS1 are also connected to the test header, through resistors (R316 and R317) as shown in Table 3-35. By default, these resistors are not installed. To use the SPI functionality on the header, either R316 or R317 must be mounted. Pin-outs of the test header (J20) are given in Table 3-34.
    Table 3-34 SPI1 Header (J20) Pin-out
    Pin no.Signal
    1SPI1_MOSI
    2SPI1_MISO
    3SPI1_CS
    4SPI1_CLK
    5DGND
    Table 3-35 Resistors for Selecting CS Signals for Test Automation Header
    Selected SPI1_CS Signal for Test HeaderMountUnmount
    SPI1_CS1R316R311
    SPI1_CS0R317R675
  • The MCU_SPI is interfaced to the CSI-2 connector.

The SPI0 and SPI1 interface signals are powered by the VDDSHV_GENERAL power supply of SoC and are at the 3.3-V I/O level.

The MCU_SPI interface signals are powered by the VDDSHV_WKUP_GENERAL power supply of SoC and are at the 3.3-V I/O level.

GUID-48FB4AEC-1B8C-4365-BBC7-B72EE356145F-low.pngFigure 3-24 SPI Tree
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