SPRUJ06 October   2021

 

  1.   Trademarks
  2. 1Introduction
  3. 2Revisions and Assembly Variants
  4. 3System Description
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Interfaces and Major Component Description
      1. 3.3.1 Breakout Board Section
      2. 3.3.2 IO-Link Section Overview and Major Component Description
        1. 3.3.2.1 IO Link Transceiver TIOL111DMWR
        2. 3.3.2.2 Smart Switch TPS4H160BQPWPRQ1
        3. 3.3.2.3 Serializer SN65HVS882
        4. 3.3.2.4 INA253
        5. 3.3.2.5 LED Driver TLC59282
        6. 3.3.2.6 Signal Routing
      3. 3.3.3 Power Section
        1. 3.3.3.1 Power Input
      4. 3.3.4 Board Mating Connections
  5. 4Known Issues
    1. 4.1 Issue 1: Voltage Spike Across the TX Line of the Transceiver

3.1 Key Features

Table 3-1 TMDS64DC01EVM and TMDS243DC01EVM Key Features
Feature TMDS64DC01EVM TMDS243DC01EVM
Eight M12 IO-Link ports with fault protection Yes No (not populated)
Sixteen individually addressable LEDs Yes No (not populated)
Access to all signals on the EVM’s HSE connector on standard 0.1" header pins Yes Yes
Signal routing of HSE connector signals between Test Headers and IO-Link section via user configurable FET switches Yes Yes
Large prototyping area with 0.1" pitch holes Yes Yes
Precision current monitoring with onboard INA253 Yes No (not populated)
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