SPRUJ32 October   2022

 

  1.   C2000 F280013x Series LaunchPad Development Kit
  2.   Trademarks
  3. 1Board Overview
    1. 1.1 Kit Contents
    2. 1.2 Features
    3. 1.3 Specifications
      1. 1.3.1 External Power Supply or Accessory Requirements
    4. 1.4 Using the F280013x LaunchPad™
    5. 1.5 BoosterPack™ Plug-in Modules
    6. 1.6 Hardware Revisions
      1. 1.6.1 Revision A
  4. 2Software Development
    1. 2.1 Software Tools and Packages
    2. 2.2 F280013x LaunchPad™ Demo Program
    3. 2.3 Programming and Running Other Software on the F280013x LaunchPad™
  5. 3Hardware Description
    1. 3.1 Functional Description and Connections
      1. 3.1.1 Microcontroller
      2. 3.1.2 Power Domains
      3. 3.1.3 LEDs
      4. 3.1.4 Encoder Connectors
      5. 3.1.5 CAN
      6. 3.1.6 Boot Modes
      7. 3.1.7 BoosterPack™ Sites
      8. 3.1.8 Analog Voltage Reference Header
      9. 3.1.9 Other Headers and Jumpers
        1. 3.1.9.1 USB Isolation Block
        2. 3.1.9.2 BoosterPack™ Site 2 Power Isolation
        3. 3.1.9.3 Alternate Power
    2. 3.2 Debug Interface
      1. 3.2.1 XDS110 Debug Probe
      2. 3.2.2 XDS110 Output
      3. 3.2.3 Virtual COM Port
    3. 3.3 Alternate Routing
      1. 3.3.1 Overview
      2. 3.3.2 UART Routing
      3. 3.3.3 EQEP Routing
      4. 3.3.4 CAN Routing
      5. 3.3.5 SPI Routing
      6. 3.3.6 X1/X2 Routing
      7. 3.3.7 PWM DAC
  6. 4Board Design
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 BOM
    4. 4.4 LAUNCHXL-F2800137 Board Dimensions
  7. 5Frequently Asked Questions (FAQs)
  8. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
  9. 7Revision History

3.1.2 Power Domains

The F280013x LaunchPad has several power domains that can be connected or isolated from each other with removable shunts. The different 3.3-V and 5-V power domains are described in Figure 3-2 and Figure 3-3.

Figure 3-2 LaunchPad™ Power Distribution Diagram
Figure 3-3 LaunchPad™ Power Plane Diagram

 

Table 3-1 describes the usage of the different removable shunts on the LaunchPad board.

Table 3-1 Power Domain Shunts
Shunt Indentifier Usage Description
JP1, +5V0 Connects the +5-V power from the USB-C connector (+5V0_USB) to the +5-V power on the XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations between the two board sides.
JP1, GND Connects the board Ground on the isolated USB-C connector side of the board (USB_GND) to the rest of the board ground (GND). Bridges the power and ground isolations between the two board sides.
JP2, +5V0 Connects the +5-V power on the XDS110 side of the board (+5V0_XDS110) to the +5-V power on the F2800137 side of the board (+5V0_MCU).
JP2, +3V3 Connects the +3.3-V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3-V power on the F2800137 side of the board (+3V3_MCU).
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