SPRUJ74 January   2023

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Key Features
    2. 1.2 Thermal Compliance
    3. 1.3 EMC, EMI, and ESD Compliance
  3. 2QP-ENET Board Identification and Installation
    1. 2.1 QP-ENET Board Component Identification
    2. 2.2 Interfacing QP-ENET Expansion Board with J784S4XG01EVM Board
      1. 2.2.1 Detailed Board Assembly Procedure (J784S4XG01EVM)
  4. 3QP-ENET Expansion Board Hardware Architecture
    1. 3.1 QP-ENET Expansion Board Hardware Top Level Diagram
    2. 3.2 Expansion Connectors
    3. 3.3 Board ID EEPROM
    4. 3.4 Ethernet Interface
      1. 3.4.1 Quad Port SGMII PHY Default Configuration
      2. 3.4.2 SGMII Clocking Scheme
        1. 3.4.2.1 Main Clock
        2. 3.4.2.2 Optional Clock
      3. 3.4.3 Ethernet Port LED Indication
      4. 3.4.4 Reset and Power-down Signals
  5. 4Revision History
  6.   A Appendix
    1.     A.1 Appendix – I (Interface Mapping)
    2.     A.2 Appendix – II (QP-ENET Board GPIO Mapping)

1.3 EMC, EMI, and ESD Compliance

Components installed on the product are sensitive to Electrostatic Discharge (ESD). TI recommends that this product be used in an ESD controlled environment. This may include a temperature and/or humidity controlled environment to limit the build-up of ESD. TI also recommends using ESD protection such as wrist straps and ESD mats when interfacing with the product.

The product is used in the basic electromagnetic environment as in laboratory condition and the applied standard will be as per EN IEC 61326-1:2021.
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