SPRUJF1 November   2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2.   Description
  3.   Key Features
  4. 1LaunchPad Module Overview
    1. 2.1 Introduction
    2. 2.2 Preface: Read This First
      1. 2.2.1 If You Need Assistance
      2. 2.2.2 Important Usage Notes
    3. 2.3 Kit Contents
    4. 2.4 Device Information
      1. 2.4.1 System Architecture Overview
      2. 2.4.2 Security
      3. 2.4.3 Compliance
      4. 2.4.4 BoosterPacks
      5. 2.4.5 Component Identification
  5. 2Hardware Description
    1. 3.1  Board Setup
      1. 3.1.1 Power Requirements
        1. 3.1.1.1 Power Input Using USB Type-C Connector
        2. 3.1.1.2 Power Status LEDs
        3. 3.1.1.3 Power Tree
      2. 3.1.2 Push Buttons
      3. 3.1.3 Boot mode Selection
      4. 3.1.4 IO Expander
    2. 3.2  Functional Block Diagram
    3. 3.3  GPIO Mapping
    4. 3.4  Reset
    5. 3.5  Clock
    6. 3.6  Memory Interfaces
      1. 3.6.1 OSPI
      2. 3.6.2 Board ID EEPROM
    7. 3.7  Ethernet Interface
      1. 3.7.1 Ethernet PHY Add-on Board connector #0 - CPSW RGMII/ICSSM
      2. 3.7.2 Ethernet PHY Add-on Board connector #1 - CPSW RGMII/ICSSM
    8. 3.8  I2C
    9. 3.9  Industrial Application LEDs
    10. 3.10 SPI
    11. 3.11 UART
    12. 3.12 MCAN
    13. 3.13 FSI
    14. 3.14 JTAG
    15. 3.15 TIVA and Test Automation Pin Mapping
    16. 3.16 LIN
    17. 3.17 ADC and DAC
    18. 3.18 EQEP and SDFM
    19. 3.19 EPWM
    20. 3.20 USB
    21. 3.21 BoosterPack Headers
  6. 3Known Issues and modifications done on LP-AM261 RevE1
    1. 4.1 TA_POWERDOWNz pulled up by VSYS_TA_3V3 which is powered by VSYS_3V3
    2. 4.2 USB2.0_MUX_SEL0 pulled up by R355
    3. 4.3 MDIO and MDC of PRU0-ICSS0 needs to be routed to both Ethernet PHYs
    4. 4.4 AM261_RGMII1_RXLINK and AM261_RGMII2_RXLINK to be connected to GPIO
  7. 4Additional Information
    1.     Trademarks
    2. 5.1 Sitara MCU+ Academy
  8. 5References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
    3. 6.3 Related Documentation From Texas Instruments
  9. 6Revision History

2.11 UART

The AM261x LaunchPad uses the XDS110 as a USB2.0 to UART bridge for terminal access. UART0 transmit and receive signals of the AM261x SoC are mapped to the XDS110 with a dual channel isolation buffer (ISO7721DR) for translating from the 3.3V IO voltage supply to the 3.3V XDS supply. The XDS110 is connected to a micro-B USB connector for the USB 2.0 signals. ESD protection is provided to the USB 2.0 signals by a transient voltage suppression device (TPD4E02B04DQAR). The micro-B USB connector's VBUS 5V power is mapped to a low dropout regulator (TPS79601DRBR) to generate the 3.3V XDS110 supply. A separate 3.3V supply for the XDS110 allows for the emulator to maintain a connection when power to the LaunchPad is removed.

UART3 instance is mapped directly to the BoosterPack header.

AM261x UART Figure 2-19 UART
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