SPRUJF1 November   2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2.   Description
  3.   Key Features
  4. 1LaunchPad Module Overview
    1. 2.1 Introduction
    2. 2.2 Preface: Read This First
      1. 2.2.1 If You Need Assistance
      2. 2.2.2 Important Usage Notes
    3. 2.3 Kit Contents
    4. 2.4 Device Information
      1. 2.4.1 System Architecture Overview
      2. 2.4.2 Security
      3. 2.4.3 Compliance
      4. 2.4.4 BoosterPacks
      5. 2.4.5 Component Identification
  5. 2Hardware Description
    1. 3.1  Board Setup
      1. 3.1.1 Power Requirements
        1. 3.1.1.1 Power Input Using USB Type-C Connector
        2. 3.1.1.2 Power Status LEDs
        3. 3.1.1.3 Power Tree
      2. 3.1.2 Push Buttons
      3. 3.1.3 Boot mode Selection
      4. 3.1.4 IO Expander
    2. 3.2  Functional Block Diagram
    3. 3.3  GPIO Mapping
    4. 3.4  Reset
    5. 3.5  Clock
    6. 3.6  Memory Interfaces
      1. 3.6.1 OSPI
      2. 3.6.2 Board ID EEPROM
    7. 3.7  Ethernet Interface
      1. 3.7.1 Ethernet PHY Add-on Board connector #0 - CPSW RGMII/ICSSM
      2. 3.7.2 Ethernet PHY Add-on Board connector #1 - CPSW RGMII/ICSSM
    8. 3.8  I2C
    9. 3.9  Industrial Application LEDs
    10. 3.10 SPI
    11. 3.11 UART
    12. 3.12 MCAN
    13. 3.13 FSI
    14. 3.14 JTAG
    15. 3.15 TIVA and Test Automation Pin Mapping
    16. 3.16 LIN
    17. 3.17 ADC and DAC
    18. 3.18 EQEP and SDFM
    19. 3.19 EPWM
    20. 3.20 USB
    21. 3.21 BoosterPack Headers
  6. 3Known Issues and modifications done on LP-AM261 RevE1
    1. 4.1 TA_POWERDOWNz pulled up by VSYS_TA_3V3 which is powered by VSYS_3V3
    2. 4.2 USB2.0_MUX_SEL0 pulled up by R355
    3. 4.3 MDIO and MDC of PRU0-ICSS0 needs to be routed to both Ethernet PHYs
    4. 4.4 AM261_RGMII1_RXLINK and AM261_RGMII2_RXLINK to be connected to GPIO
  7. 4Additional Information
    1.     Trademarks
    2. 5.1 Sitara MCU+ Academy
  8. 5References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
    3. 6.3 Related Documentation From Texas Instruments
  9. 6Revision History

ADC and DAC

The AM261x LaunchPad maps 20 ADC inputs to the BoosterPack header. All of the ADC inputs that are used in the LaunchPad are ESD protected.

AM261x ADC/DAC Signal Pathing Figure 2-24 ADC/DAC Signal Pathing

Multiple muxes are involved from AM261x Soc to BoosterPack connectors. Detailed table is given in Boosterpack section.

The ADC and DAC require a voltage reference. The AM261x LaunchPad has two switches that allow the user to switch between the DAC and ADC VREF source.

AM261x ADC and DAC VREF Switches Figure 2-25 ADC and DAC VREF Switches

The DAC VREF Switch (S1) is a single pole double throw switch that controls the input of the ADC VREF inputs of the AM261x SoC.

Table 2-12 DAC VREF Switch
DAC VREF Switch PositionReference Selection
Pin 1-2 AM261x on-die LDO
Pin 2-3External DAC VREF Header

The ADC VREF Switch (S2) contains two single pole double throw switches that controls the input of the ADC VREF inputs of the AM261x SoC.

Table 2-13 ADC VREF Switch
ADC VREF Switch PositionReference Selection
Pin 1-2 OPEN - Allow for reference to be AM261x on-die LDO reference
Pin 2-3External ADC VREF Header
Pin 4-5OPEN - Allow for reference to be AM261x on-die LDO reference
Pin 5-6External ADC VREF Header