SPRUJF1 November   2024 AM2612

ADVANCE INFORMATION  

1.   1
2.   Description
3.   Key Features
4. 1LaunchPad Module Overview
   1. 2.1 Introduction
   2. 2.2 Preface: Read This First
      1. 2.2.1 If You Need Assistance
      2. 2.2.2 Important Usage Notes
   3. 2.3 Kit Contents
   4. 2.4 Device Information
      1. 2.4.1 System Architecture Overview
      2. 2.4.2 Security
      3. 2.4.3 Compliance
      4. 2.4.4 BoosterPacks
      5. 2.4.5 Component Identification
5. 2Hardware Description
   1. 3.1  Board Setup
      1. 3.1.1 Power Requirements
         1. 3.1.1.1 Power Input Using USB Type-C Connector
         2. 3.1.1.2 Power Status LEDs
         3. 3.1.1.3 Power Tree
      2. 3.1.2 Push Buttons
      3. 3.1.3 Boot mode Selection
      4. 3.1.4 IO Expander
   2. 3.2  Functional Block Diagram
   3. 3.3  GPIO Mapping
   4. 3.4  Reset
   5. 3.5  Clock
   6. 3.6  Memory Interfaces
      1. 3.6.1 OSPI
      2. 3.6.2 Board ID EEPROM
   7. 3.7  Ethernet Interface
      1. 3.7.1 Ethernet PHY Add-on Board connector #0 - CPSW RGMII/ICSSM
      2. 3.7.2 Ethernet PHY Add-on Board connector #1 - CPSW RGMII/ICSSM
   8. 3.8  I2C
   9. 3.9  Industrial Application LEDs
   10. 3.10 SPI
   11. 3.11 UART
   12. 3.12 MCAN
   13. 3.13 FSI
   14. 3.14 JTAG
   15. 3.15 TIVA and Test Automation Pin Mapping
   16. 3.16 LIN
   17. 3.17 ADC and DAC
   18. 3.18 EQEP and SDFM
   19. 3.19 EPWM
   20. 3.20 USB
   21. 3.21 BoosterPack Headers
6. 3Known Issues and modifications done on LP-AM261 RevE1
   1. 4.1 TA_POWERDOWNz pulled up by VSYS_TA_3V3 which is powered by VSYS_3V3
   2. 4.2 USB2.0_MUX_SEL0 pulled up by R355
   3. 4.3 MDIO and MDC of PRU0-ICSS0 needs to be routed to both Ethernet PHYs
   4. 4.4 AM261_RGMII1_RXLINK and AM261_RGMII2_RXLINK to be connected to GPIO
7. 4Additional Information
   1.     Trademarks
   2. 5.1 Sitara MCU+ Academy
8. 5References
   1. 6.1 Reference Documents
   2. 6.2 Other TI Components Used in This Design
   3. 6.3 Related Documentation From Texas Instruments
9. 6Revision History