SPRZ342O January   2011  – April 2021 TMS320F28062 , TMS320F28062-Q1 , TMS320F28062F , TMS320F28062F-Q1 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28066-Q1 , TMS320F28067 , TMS320F28067-Q1 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069-Q1 , TMS320F28069F , TMS320F28069F-Q1 , TMS320F28069M , TMS320F28069M-Q1

 

  1.   Abstract
  2. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  3. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  4. 3Silicon Revision B Usage Notes and Advisories
    1. 3.1 Silicon Revision B Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 CAN Bootloader: Internal Oscillator Tolerance is Not Sufficient for CAN Operation at High Temperatures
      3. 3.1.3 FPU32 and VCU Back-to-Back Memory Accesses
      4. 3.1.4 Caution While Using Nested Interrupts
      5. 3.1.5 Flash: MAX "Program Time” and “Erase Time” in Revision G of the TMS320F2806x Piccolo™ Microcontrollers Data Manual are only Applicable for Devices Manufactured After January 2018
    2. 3.2 Silicon Revision B Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17.      Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22.      Advisory
      23.      Advisory
      24.      Advisory
      25.      Advisory
      26.      Advisory
      27.      Advisory
  5. 4Silicon Revision A Usage Notes and Advisories
    1. 4.1 Silicon Revision A Usage Notes
    2. 4.2 Silicon Revision A Advisories
  6. 5Silicon Revision 0 Usage Notes and Advisories
    1. 5.1 Silicon Revision 0 Usage Notes
    2. 5.2 Silicon Revision 0 Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
  7. 6Documentation Support
  8. 7Trademarks
  9. 8Revision History

Advisory

ADC: Offset Self-Recalibration Requirement

Revision(s) Affected

0, A, B

Details

The factory offset calibration from Device_cal() may not ensure that the ADC offset remains within specifications under all operating conditions in the customer's system.

Workaround(s)

  • To ensure that the offset remains within the data sheet's “single recalibration” specifications, perform the AdcOffsetSelfCal() function after Device_cal() has completed and the ADC has been configured.
  • To ensure that the offset remains within the data sheet's “periodic recalibration” specifications, perform the AdcOffsetSelfCal() function periodically with respect to temperature drift.

For more details on AdcOffsetSelfCal(), refer to the “ADC Zero Offset Calibration” section in the Analog-to-Digital Converter and Comparator chapter of the TMS320x2806x Real-Time Microcontrollers Technical Reference Manual.
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