SPRZ397K November   2012  – September 2024 TDA2EG-17 , TDA2HF , TDA2HG , TDA2HV , TDA2LF , TDA2SA , TDA2SG , TDA2SX

 

  1.   1
  2. 1Introduction
    1.     Related Documentation
    2.     Trademarks
    3.     Modules Impacted
  3. 2Silicon Advisories
    1.     Revisions SR 2.0, 1.1, 1.0 - Advisories List
    2.     i202
    3.     i378
    4.     i631
    5.     i694
    6.     i698
    7.     i699
    8.     i727
    9.     i729
    10.     i734
    11.     i767
    12.     i782
    13.     i783
    14.     i802
    15.     i803
    16.     i807
    17.     i808
    18.     i809
    19.     i810
    20.     i813
    21.     i814
    22.     i815
    23.     i818
    24.     i819
    25.     i820
    26.     i824
    27.     i826
    28.     i829
    29.     i834
    30.     i837
    31.     i840
    32.     i841
    33.     i842
    34.     i843
    35.     i847
    36.     i849
    37.     i852
    38.     i854
    39.     i855
    40.     i856
    41.     i859
    42.     i861
    43.     i862
    44.     i863
    45.     i868
    46.     i869
    47.     i870
    48.     i871
    49.     i872
    50.     i874
    51.     i875
    52.     i878
    53.     i879
    54.     i880
    55.     i882
    56.     i883
    57.     i884
    58.     i887
    59.     i889
    60.     i890
    61.     i893
    62.     i895
    63.     i896
    64.     i897
    65.     i898
    66.     i899
    67.     i900
    68.     i901
    69.     i903
    70.     i916
    71.     i927
    72.     i929
    73.     i930
    74.     i932
    75.     i933
    76.     i936
    77.     i940
    78.     i2446
  4. 3Silicon Limitations
    1.     Revisions SR 2.0, 1.1, 1.0 - Limitations List
    2.     i596
    3.     i641
    4.     i833
    5.     i838
    6.     i844
    7.     i845
    8.     i848
    9.     i850
    10.     i851
    11.     i853
    12.     i857
    13.     i858
    14.     i876
    15.     i877
    16.     i892
    17.     i909
  5. 4Silicon Cautions
    1.     Revisions SR 2.0, 1.1, 1.0 - Cautions List
    2.     i781
    3. 4.1 106
    4.     i827
    5.     i832
    6.     i836
    7.     i839
    8.     i864
    9.     i885
    10.     i886
    11.     i912
    12.     i926
    13.     i931
    14.     i935
  6. 5Revision History

i868

McASP to EDMA Synchronization Level Event Can Be Lost

CRITICALITY

Medium

DESCRIPTION

The McASP FIFO events to the EDMA or System DMA can be lost depending on the timing between the McASP side activity and the DMA side activity. The problem is most likely to occur in a heavily loaded system which can cause the DMA latency to increase and potentially hit the problematic timing window. When an event is lost, the McASP FIFO Rx path will overflow or the Tx path will underflow. Software intervention is required to recover from this condition.

The issue results due to a state machine boundary condition in the McASP FIFO logic. In normal operation, when "Threshold" (set by the RFIFOCTL[15:8] RNUMEVT and WFIFOCTL[15:8] WNUMEVT registers) words of data are read/written by the DMA then the previous event would be cleared. Similarly, when "Threshold" words of data are written/read from the pins, a new event should be set. If these two conditions occur at the same exact time (within a 2 cycle window), then there is a conflict in the set/clear logic and the event is cleared but is not re-asserted to the DMA.

WORKAROUND

Since the McASP is a real time peripheral, any loss of data due to underflow/overflow should be avoided by eliminating the possibility of DMA read/write completing at the same time as a new McASP Event. Software should configure the system to:

  1. Maximize time until the deadline for the McASP FIFO
  2. Minimize DMA service time for McASP related transfers

In order to maximize time until deadline, the RNUMEVT and WNUMEVT should be set to the largest multiple of "number of serializers active" that is less-than-equal-to 32 words. Since the FIFO is 64-Words deep, this gives the maximum time to avoid the boundary condition.

In order to minimize DMA service time for McASP related transfers multiple options are possible. For example, McASP buffers can be placed in OCMCRAM or DSP's L2 SRAM (since on chip memories provide a more deterministic and lower latency path compared to DDR memory). In addition, a dedicated Queue/TC can be allocated to McASP transfers. At minimum, care should be taken to avoid any long transfers on the same Queue/TC to avoid head-of-line blocking latency.

REVISIONS IMPACTED

SR 1.1, 1.0

TDA2x: 1.1, 1.0

DRA75x, DRA74x: 1.1, 1.0

AM572x: 1.1