SPRZ426F November   2014  – September 2024 DRA710 , DRA712 , DRA714 , DRA716 , DRA718 , DRA722 , DRA724 , DRA725 , DRA726

 

  1.   1
  2. 1Introduction
    1.     Related Documentation
    2.     Trademarks
    3.     Modules Impacted
  3. 2Silicon Advisories
    1.     Revisions SR 2.1, 2.0, 1.0 - Advisories List
    2.     i202
    3.     i378
    4.     i631
    5.     i694
    6.     i698
    7.     i699
    8.     i709
    9.     i727
    10.     i729
    11.     i734
    12.     i767
    13.     i782
    14.     i783
    15.     i802
    16.     i803
    17.     i807
    18.     i808
    19.     i809
    20.     i810
    21.     i813
    22.     i814
    23.     i815
    24.     i818
    25.     i819
    26.     i820
    27.     i824
    28.     i826
    29.     i829
    30.     i834
    31.     i849
    32.     i856
    33.     i862
    34.     i863
    35.     i867
    36.     i868
    37.     i869
    38.     i870
    39.     i871
    40.     i872
    41.     i874
    42.     i875
    43.     i878
    44.     i879
    45.     i880
    46.     i881
    47.     i882
    48.     i883
    49.     i887
    50.     i889
    51.     i890
    52.     i893
    53.     i895
    54.     i896
    55.     i897
    56.     i898
    57.     i899
    58.     i900
    59.     i903
    60.     i904
    61.     i906
    62.     i913
    63.     i916
    64.     i927
    65.     i928
    66.     i929
    67.     i930
    68.     i932
    69.     i933
    70.     i940
    71.     i2446
  4. 3Silicon Limitations
    1.     Revisions SR 2.1, 2.0, 1.0 - Limitations List
    2.     i596
    3.     i641
    4.     i833
    5.     i838
    6.     i844
    7.     i845
    8.     i848
    9.     i876
    10.     i877
    11.     i892
    12.     i909
    13.     i917
  5. 4Silicon Cautions
    1.     Revisions SR 2.1, 2.0, 1.0 - Cautions List
    2.     i781
    3. 4.1 95
    4.     i827
    5.     i832
    6.     i836
    7.     i839
    8.     i864
    9.     i885
    10.     i886
    11.     i912
    12.     i918
    13.     i920
    14.     i926
    15.     i931
    16.     i934
    17. 4.2 109
  6. 5Revision History

i875

Power-on-Reset (PORz) Warm Boot Hang

CRITICALITY

High

DESCRIPTION

Following a warm Power-on-Reset (PORz) event, in which the supplies to the SoC remain ON throughout the assertion of PORz, the boot process may hang if the SoC is within a narrow temperature range.

The sensitive temperature range can be different on each device, is typically ~5oC wide, and typically occurs below 25oC.

The boot issue occurs only when the PORz signal is asserted to the SoC without turning-off the supplies to the SoC. No issue is observed in normal cold-boot operation in which the SoC boots up from a full power-off condition.

This erratum does not occur in typical use case scenarios. The boot hang may occur only if the PORz event is generated as a consequence of some other issue (e.g., runtime reset from an external MCU, or an SoC watchdog timer expiration resulting in PORz assertion) while the SoC temperature is within a narrow range.

The issue results from improper power sequencing to an internal SRAM that is accessed during execution of the early stages of the boot process. During assertion of PORz, the SoC's on-chip LDO regulator supplying the SRAM tri-states its output, thus allowing internal supplies to the SRAM to drift down uncontrolled. This can result in improper sequencing as the LDO reapplies power to the SRAM upon de-assertion of PORz before internal supplies to the SRAM have fully ramped down. This situation can result in incorrect accesses to the SRAM during boot, causing the boot process to halt.

WORKAROUND

A board level workaround requires adding a 220 Ohm (+/- 5%) resistor onto the SRAM LDO supply (Cap_vddram_mpu2, ball K19). This resistor provides a controlled discharge path for the charge contained within the external 1uF LDO capacitor during the reset operation. The workaround effectiveness assumes that the active duration of the PORz signal is a typical 3.4ms or greater.

In systems with an MCU present, a second workaround technique can be utilized. The MCU performs a handshake with the device following a warm PORz to ensure that the device is responsive after the reset. On the occasion a hang occurs, the MCU should assert PORZ low for 200 ms. This eliminates the need for an external 220 Ohm resistor.

REVISIONS IMPACTED

DRA72x SR 1.0

TDA2Ex (23mm): 1.0

AM571x: 1.0

DRA72x: 1.0