SPRZ439H January   2017  – February 2024 TMS320F280040-Q1 , TMS320F280040C-Q1 , TMS320F280041 , TMS320F280041-Q1 , TMS320F280041C , TMS320F280041C-Q1 , TMS320F280045 , TMS320F280048-Q1 , TMS320F280048C-Q1 , TMS320F280049 , TMS320F280049-Q1 , TMS320F280049C , TMS320F280049C-Q1

 

  1.   1
  2.   TMS320F28004x Real-Time MCUs Silicon Errata (Silicon Revisions B, A, 0)
  3. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Silicon Revision B Usage Notes and Advisories
    1. 3.1 Silicon Revision B Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 FPU32 and VCU Back-to-Back Memory Accesses
      3. 3.1.3 Caution While Using Nested Interrupts
      4. 3.1.4 Security: The primary layer of defense is securing the boundary of the chip, which begins with enabling JTAGLOCK and Zero-pin Boot to Flash feature
    2. 3.2 Silicon Revision B Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17. 3.2.1 Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22. 3.2.2 Advisory
      23.      Advisory
      24.      Advisory
      25.      Advisory
      26.      Advisory
      27.      Advisory
      28. 3.2.3 Advisory
      29.      Advisory
      30.      Advisory
      31. 3.2.4 Advisory
  6. 4Silicon Revision A Usage Notes and Advisories
    1. 4.1 Silicon Revision A Usage Notes
    2. 4.2 Silicon Revision A Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
  7. 5Silicon Revision 0 Usage Notes and Advisories
    1. 5.1 Silicon Revision 0 Usage Notes
    2. 5.2 Silicon Revision 0 Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
  8. 6Documentation Support
  9. 7Trademarks
  10. 8Revision History

Advisory

INTOSC: VDDIO Powered Without VDD Can Cause INTOSC Frequency Drift

Revisions Affected

0, A, B

Details

The "D" revision of the TMS320F28004x Real-Time Microcontrollers data sheet (SPRS945D) has updated power sequencing requirements. Revision "C" and earlier revisions of the data sheet did not require VDDIO and VDD to be powered on and powered off at the same time when using an external supply source for VDD.

If VDDIO is powered on while VDD is not powered, there will be an accumulating and persistent downward frequency drift for INTOSC1 and INTOSC2. The rate of drift accumulated will be greater when VDDIO is powered without VDD at high temperatures.

As a result of this drift, the INTOSC1 and INTOSC2 internal oscillator frequencies could fall below the minimum values specified in the data sheet. This would impact applications using INTOSC2 as the clock source for the PLL, with the system operating at a lower frequency than expected.

Workarounds

  1. Use the internal VREG or internal DCDC, which will ensure VDD is powered when VDDIO is present.
  2. When using an external VDD source, always keep VDDIO and VDD powered together.
  3. Use the external X1 and X2 crystal oscillators as the PLL clock source. The crystal oscillator does not have any drift related to VDDIO and VDD supply sequencing.