SPRZ447E July   2017  – July 2024 AM5746 , AM5748 , AM5749

 

  1.   1
  2. 1Introduction
    1.     Related Documentation
    2.     Trademarks
    3.     Modules Impacted
  3. 2Silicon Advisories
    1.     Revisions SR 1.0 - Advisories List
    2.     i202
    3.     i378
    4.     i631
    5.     i694
    6.     i698
    7.     i699
    8.     i709
    9.     i727
    10.     i729
    11.     i734
    12.     i767
    13.     i782
    14.     i783
    15.     i802
    16.     i803
    17.     i807
    18.     i808
    19.     i809
    20.     i810
    21.     i813
    22.     i814
    23.     i815
    24.     i818
    25.     i819
    26.     i820
    27.     i824
    28.     i826
    29.     i829
    30.     i834
    31.     i849
    32.     i856
    33.     i862
    34.     i863
    35.     i869
    36.     i870
    37.     i871
    38.     i872
    39.     i874
    40.     i878
    41.     i879
    42.     i883
    43.     i889
    44.     i890
    45.     i893
    46.     i896
    47.     i897
    48.     i898
    49.     i899
    50.     i900
    51.     i903
    52.     i904
    53.     i916
    54.     i929
    55.     i930
    56.     i932
    57.     i933
    58.     i936
    59.     i940
    60.     i2446
  4. 3Silicon Limitations
    1.     Revisions SR 1.0 - Limitations List
    2.     i596
    3.     i641
    4.     i833
    5.     i838
    6.     i845
    7.     i848
    8.     i876
    9.     i877
    10.     i892
    11.     i909
    12.     i925
  5. 4Silicon Cautions
    1.     Revisions SR 1.0 - Cautions List
    2.     i827
    3.     i832
    4.     i836
    5.     i839
    6.     i864
    7.     i885
    8.     i886
    9.     i912
    10.     i926
    11.     i931
    12.     i935
    13.     i937
  6. 5Revision History

i729

DDR Access Hang after Warm Reset

CRITICALITY

Medium

DESCRIPTION

When warm reset is asserted, EMIF will preserve the contents of the DDR by entering self-refresh. During warm reset the DDR clock source is set to a slower PLL bypass than during normal operation. This causes the following JEDEC spec violations and could result in a DDR access hang after warm reset:

  • DDR clock frequency to the DDR memory is lower than the JEDEC min. clock frequency specified as tCK(avg) min parameter in the JEDEC JESD79-3F DDR3 standard.
  • Upon warm reset de-assertion, DDR is taken out of self-refresh and DDR clock frequency is changed from PLL bypass to normal operating frequency. This violates the JEDEC JESD79-3F DDR3 standard that requires input clock to be stable during normal operation.

WORKAROUND

There are 3 possible work-around options:

  1. Use workaround as outlined in Errata i862 to convert warm reset to PORz. Warm reset will function the same as cold reset with this approach.
  2. Use external circuitry to apply reset on DDR RESET# pin when warm reset is asserted. DDR contents will be erased upon warm reset with this approach.
  3. When warm reset is asserted, EMIF enters idle state and switches the external SDRAM device to self-refresh mode. The external SDRAM device switches to active mode after the warm reset time RSTTIME1. For more details on this behavior, see section Global Warm Reset Sequence of chapter Power, Reset, and Clock Management of the Device TRM.
    To work around the issue in this advisory, program the CTRL_CORE_SMA_SW_0[6] WARM_SFORCE_EN bit to 1, which extends the self-refresh of the external SDRAM device until the CTRL_CORE_SMA_SW_0[5] WARM_SFORCE bit is cleared by software. Due to the self-refresh extension of the external SDRAM device, the DDR PLL is set back to functional frequency before EMIF enters active mode. For more details on CTRL_CORE_SMA_SW_0 register fields, see the CTRL_CORE_SMA_SW_0 register description in the Device TRM.

Note: Workaround #3 is the required workaround to preserve DDR contents during warm reset.

REVISIONS IMPACTED

SR 1.0

This erratum is considered negated on AM574x SR 1.0 and AM576x SR 1.0 by implementing workaround #3.

AM574x: 1.0

DRA75xP, DRA74xP, DRA77xP, DRA76xP: 1.0

TDA2Px: 1.0

AM576x: 1.0