SWCU193A April   2023  – August 2024 CC2340R2 , CC2340R5 , CC2340R5-Q1

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Devices
    3.     Register, Field, and Bit Calls
    4.     Related Documentation
    5.     Trademarks
  3. 1 Architectural Overview
    1. 1.1  Target Applications
    2. 1.2  Introduction
    3. 1.3  Arm Cortex M0+
      1. 1.3.1 Processor Core
      2. 1.3.2 SysTick Timer
      3. 1.3.3 Nested Vectored Interrupt Controller
      4. 1.3.4 System Control Block (SCB)
    4. 1.4  On-Chip Memory
      1. 1.4.1 SRAM
      2. 1.4.2 Flash
      3. 1.4.3 ROM
    5. 1.5  Power Supply System
      1. 1.5.1 VDDS
      2. 1.5.2 VDDR
      3. 1.5.3 VDDD Digital Core Supply
      4. 1.5.4 DC/DC Converter
    6. 1.6  Radio
    7. 1.7  AES 128-bit Cryptographic Accelerator
    8. 1.8  System Timer (SYSTIM)
    9. 1.9  General Purpose Timers (LGPT)
    10. 1.10 Always-ON (AON) or Ultra-Low Leakage (ULL) Domain
      1. 1.10.1 Watchdog Timer
      2. 1.10.2 Battery and Temperature Monitor
      3. 1.10.3 Real-time Clock (RTC)
      4. 1.10.4 Low Power Comparator
    11. 1.11 Direct Memory Access
    12. 1.12 System Control and Clock
    13. 1.13 Communication Peripherals
      1. 1.13.1 UART
      2. 1.13.2 I2C
      3. 1.13.3 SPI
    14. 1.14 Programmable I/Os
    15. 1.15 Serial Wire Debug (SWD)
  4. 2  Arm Cortex-M0+ Processor
    1. 2.1 Introduction
    2. 2.2 Block Diagram
    3. 2.3 Overview
      1. 2.3.1 Peripherals
      2. 2.3.2 Programmer's Model
      3. 2.3.3 Instruction Set Summary
      4. 2.3.4 Memory Model
    4. 2.4 Registers
      1. 2.4.1 BPU Registers
      2. 2.4.2 CPU_ROM_TABLE Registers
      3. 2.4.3 DCB Registers
      4. 2.4.4 SCB Registers
      5. 2.4.5 SCSCS Registers
      6. 2.4.6 NVIC Registers
      7. 2.4.7 SYSTICK Registers
  5. 3 Memory Map
    1. 3.1 Memory Map
  6. 4 Interrupts and Events
    1. 4.1 Exception Model
      1. 4.1.1 Exception States
      2. 4.1.2 Exception Types
      3. 4.1.3 Exception Handlers
      4. 4.1.4 Vector Table
      5. 4.1.5 Exception Priorities
      6. 4.1.6 Exception Entry and Return
        1. 4.1.6.1 Exception Entry
        2. 4.1.6.2 Exception Return
    2. 4.2 Fault Handling
      1. 4.2.1 Lockup
    3. 4.3 Event Fabric
      1. 4.3.1 Introduction
      2. 4.3.2 Overview
      3. 4.3.3 Registers
      4. 4.3.4 AON Event Fabric
        1. 4.3.4.1 AON Common Input Events List
        2. 4.3.4.2 AON Event Subscribers
        3. 4.3.4.3 Power Management Controller (PMCTL)
        4. 4.3.4.4 Real Time Clock (RTC)
        5. 4.3.4.5 AON to MCU Event Fabric
      5. 4.3.5 MCU Event Fabric
        1. 4.3.5.1 Common Input Event List
        2. 4.3.5.2 MCU Event Subscribers
          1. 4.3.5.2.1 System CPU
          2. 4.3.5.2.2 Non-Maskable Interrupt (NMI)
    4. 4.4 Digital Test Bus (DTB)
    5. 4.5 EVTULL Registers
    6. 4.6 EVTSVT Registers
  7. 5 Debug Subsystem
    1. 5.1  Introduction
    2. 5.2  Block Diagram
    3. 5.3  Overview
      1. 5.3.1 Physical Interface
      2. 5.3.2 Debug Access Ports
    4. 5.4  Debug Features
      1. 5.4.1 Processor Debug
      2. 5.4.2 Breakpoint Unit (BPU)
      3. 5.4.3 Peripheral Debug
    5. 5.5  Behavior in Low Power Modes
    6. 5.6  Restricting Debug Access
    7. 5.7  Mailbox (DSSM)
    8. 5.8  Mailbox Events
      1. 5.8.1 CPU Interrupt Event (AON_DBG_COMB)
    9. 5.9  Software Considerations
    10. 5.10 DBGSS Registers
  8. 6 Power, Reset, and Clocking
    1. 6.1  Introduction
    2. 6.2  System CPU Modes
    3. 6.3  Supply System
      1. 6.3.1 Internal DC/DC Converter and Global LDO
    4. 6.4  Power States
      1. 6.4.1 Reset
      2. 6.4.2 Shutdown
      3. 6.4.3 Active
      4. 6.4.4 Idle
      5. 6.4.5 Standby
    5. 6.5  Digital Power Partitioning
    6. 6.6  Clocks
      1. 6.6.1 CLKSVT
      2. 6.6.2 CLKULL
    7. 6.7  Resets
      1. 6.7.1 Watchdog Timer (WDT)
      2. 6.7.2 LF Loss Detection
    8. 6.8  AON (REG3V3) Register Bank
    9. 6.9  CKMD Registers
    10. 6.10 CLKCTL Registers
    11. 6.11 PMCTL Registers
  9. 7 Internal Memory
    1. 7.1 SRAM
    2. 7.2 VIMS
      1. 7.2.1 Introduction
      2. 7.2.2 Block Diagram
      3. 7.2.3 Cache
        1. 7.2.3.1 Basic Cache Mechanism
        2. 7.2.3.2 Cache Prefetch Mechanism
        3. 7.2.3.3 Cache Micro-Prediction Mechanism
      4. 7.2.4 Flash
        1. 7.2.4.1 Flash Read-Only Protection
        2. 7.2.4.2 Flash Memory Programming
      5. 7.2.5 ROM
    3. 7.3 VIMS Registers
    4. 7.4 FLASH Registers
  10. 8 Device Boot and Bootloader
    1. 8.1 Device Boot and Programming
      1. 8.1.1 Boot Flow
      2. 8.1.2 Boot Timing
      3. 8.1.3 Boot Status
      4. 8.1.4 Boot Protection/Locking Mechanisms
      5. 8.1.5 Debug and Active SWD Connections at Boot
      6. 8.1.6 Flashless Test Mode and Tools Client Mode
        1. 8.1.6.1 Flashless Test Mode
        2. 8.1.6.2 Tools Client Mode
      7. 8.1.7 Retest Mode and Return-to-Factory Procedure
      8. 8.1.8 Disabling SWD Debug Port
    2. 8.2 Flash Programming
      1. 8.2.1 CCFG
      2. 8.2.2 CCFG Permissions/Restrictions that Affect Flash Programming
      3. 8.2.3 SACI Flash Programming Commands
      4. 8.2.4 Flash Programming Flows
        1. 8.2.4.1 Initial Programming of a New Device
        2. 8.2.4.2 Reprogramming of Previously Programmed Device
        3. 8.2.4.3 Add User Record on Already Programmed Device as Part of Commissioning Step
        4. 8.2.4.4 Incrementally Program Ancillary Data to MAIN Flash Sectors of a Previously Programmed Device
        5. 8.2.4.5 Debug Flow Charts
    3. 8.3 Device Management Command Interface
      1. 8.3.1 SACI Communication Protocol
        1. 8.3.1.1 Host Side Protocol
        2. 8.3.1.2 Command Format
        3. 8.3.1.3 Response Format
        4. 8.3.1.4 Response Result Field
        5. 8.3.1.5 Command Sequence Tag
        6. 8.3.1.6 Host Side Timeout
      2. 8.3.2 SACI Commands
        1. 8.3.2.1 Miscellaneous Commands
          1. 8.3.2.1.1 SACI_CMD_MISC_NO_OPERATION
          2. 8.3.2.1.2 SACI_CMD_MISC_GET_DIE_ID
          3. 8.3.2.1.3 SACI_CMD_MISC_GET_CCFG_USER_REC
        2. 8.3.2.2 Debug Commands
          1. 8.3.2.2.1 SACI_CMD_DEBUG_REQ_PWD_ID
          2. 8.3.2.2.2 SACI_CMD_DEBUG_SUBMIT_AUTH
          3. 8.3.2.2.3 SACI_CMD_DEBUG_EXIT_SACI_HALT
          4. 8.3.2.2.4 SACI_CMD_DEBUG_EXIT_SACI_SHUTDOWN
          5. 8.3.2.2.5 SACI_CMD_BLDR_APP_RESET_DEVICE
          6. 8.3.2.2.6 SACI_CMD_BLDR_APP_EXIT_SACI_RUN
        3. 8.3.2.3 Flash Programming Commands
          1. 8.3.2.3.1 SACI_CMD_FLASH_ERASE_CHIP
          2. 8.3.2.3.2 SACI_CMD_FLASH_PROG_CCFG_SECTOR
          3. 8.3.2.3.3 SACI_CMD_FLASH_PROG_CCFG_USER_REC
          4. 8.3.2.3.4 SACI_CMD_FLASH_PROG_MAIN_SECTOR
          5. 8.3.2.3.5 SACI_CMD_FLASH_PROG_MAIN_PIPELINED
          6. 8.3.2.3.6 SACI_CMD_FLASH_VERIFY_MAIN_SECTORS
          7. 8.3.2.3.7 SACI_CMD_FLASH_VERIFY_CCFG_SECTOR
    4. 8.4 Bootloader Support
      1. 8.4.1 Bootloader Parameters
      2. 8.4.2 Persistent State
      3. 8.4.3 User-Defined Bootloader Guidelines
    5. 8.5 ROM Serial Bootloader
      1. 8.5.1 ROM Serial Bootloader Interfaces
        1. 8.5.1.1 Packet Handling
          1. 8.5.1.1.1 Packet Acknowledge and Not-Acknowledge Bytes
        2. 8.5.1.2 Transport Layer
          1. 8.5.1.2.1 UART Transport
            1. 8.5.1.2.1.1 UART Baud Rate Automatic Detection
          2. 8.5.1.2.2 SPI Transport
      2. 8.5.2 ROM Serial Bootloader Parameters
      3. 8.5.3 ROM Serial Bootloader Commands
        1. 8.5.3.1 BLDR_CMD_PING
        2. 8.5.3.2 BLDR_CMD_GET_STATUS
        3. 8.5.3.3 BLDR_CMD_GET_PART_ID
        4. 8.5.3.4 BLDR_CMD_RESET
        5. 8.5.3.5 BLDR_CMD_CHIP_ERASE
        6. 8.5.3.6 BLDR_CMD_CRC32
        7. 8.5.3.7 BLDR_CMD_DOWNLOAD
        8. 8.5.3.8 BLDR_CMD_DOWNLOAD_CRC
        9. 8.5.3.9 BLDR_CMD_SEND_DATA
      4. 8.5.4 Bootloader Firmware Update Example
  11. 9 Device Configuration
    1. 9.1 Factory Configuration (FCFG)
    2. 9.2 Customer Configuration (CCFG)
  12. 10General Purpose Timers (LGPT)
    1. 10.1 Overview
    2. 10.2 Block Diagram
    3. 10.3 Functional Description
      1. 10.3.1  Prescaler
      2. 10.3.2  Counter
      3. 10.3.3  Target
      4. 10.3.4  Channel Input Logic
      5. 10.3.5  Channel Output Logic
      6. 10.3.6  Channel Actions
        1. 10.3.6.1 Period and Pulse Width Measurement
        2. 10.3.6.2 Clear on Zero, Toggle on Compare Repeatedly
        3. 10.3.6.3 Set on Zero, Toggle on Compare Repeatedly
      7. 10.3.7  Channel Capture Configuration
      8. 10.3.8  Channel Filters
        1. 10.3.8.1 Setting up the Channel Filters
      9. 10.3.9  Synchronize Multiple LGPT Timers
      10. 10.3.10 Interrupts, ADC Trigger, and DMA Request
    4. 10.4 Timer Modes
      1. 10.4.1 Quadrature Decoder
      2. 10.4.2 DMA
      3. 10.4.3 IR Generation
      4. 10.4.4 Fault and Park
      5. 10.4.5 Deadband
      6. 10.4.6 Deadband, Fault, and Park
      7. 10.4.7 Example Application: Brushless DC (BLDC) Motor
    5. 10.5 LGPT0 Registers
    6. 10.6 LGPT1 Registers
    7. 10.7 LGPT2 Registers
    8. 10.8 LGPT3 Registers
  13. 11System Timer (SYSTIM)
    1. 11.1 Overview
    2. 11.2 Block Diagram
    3. 11.3 Functional Description
      1. 11.3.1 Common Channel Features
        1. 11.3.1.1 Compare Mode
        2. 11.3.1.2 Capture Mode
        3. 11.3.1.3 Additional Channel Arming Methods
      2. 11.3.2 Interrupts and Events
    4. 11.4 SYSTIM Registers
  14. 12Real Time Clock (RTC)
    1. 12.1 Introduction
    2. 12.2 Block Diagram
    3. 12.3 Interrupts and Events
      1. 12.3.1 Input Event
      2. 12.3.2 Output Event
      3. 12.3.3 Arming and Disarming Channels
    4. 12.4 Capture and Compare Configuration
      1. 12.4.1 Capture
      2. 12.4.2 Compare
    5. 12.5 RTC Registers
  15. 13Low Power Comparator and SYS0
    1. 13.1 Introduction
    2. 13.2 Block Diagram
    3. 13.3 Functional Description
      1. 13.3.1 Input Selection
      2. 13.3.2 Voltage Divider
      3. 13.3.3 Hysteresis
      4. 13.3.4 Wake-Up
    4. 13.4 SYS0 Registers
  16. 14Battery Monitor, Temperature Sensor, and DCDC Controller (PMUD)
    1. 14.1 Introduction
    2. 14.2 Functional Description
      1. 14.2.1 BATMON
      2. 14.2.2 DCDC
    3. 14.3 PMUD Registers
  17. 15Micro Direct Memory Access (µDMA)
    1. 15.1 Introduction
    2. 15.2 Block Diagram
    3. 15.3 Functional Description
      1. 15.3.1  Channel Assignments
      2. 15.3.2  Priority
      3. 15.3.3  Arbitration Size
      4. 15.3.4  Request Types
        1. 15.3.4.1 Single Request
        2. 15.3.4.2 Burst Request
      5. 15.3.5  Channel Configuration
      6. 15.3.6  Transfer Modes
        1. 15.3.6.1 Stop Mode
        2. 15.3.6.2 Basic Mode
        3. 15.3.6.3 Auto Mode
        4. 15.3.6.4 Ping-Pong Mode
        5. 15.3.6.5 Memory Scatter-Gather Mode
        6. 15.3.6.6 Peripheral Scatter-Gather Mode
      7. 15.3.7  Transfer Size and Increments
      8. 15.3.8  Peripheral Interface
      9. 15.3.9  Software Request
      10. 15.3.10 Interrupts and Errors
      11. 15.3.11 Initialization and Configuration
        1. 15.3.11.1 Module Initialization
        2. 15.3.11.2 Configuring a Memory-to-Memory Transfer
        3. 15.3.11.3 Configure the Channel Attributes
        4. 15.3.11.4 Configure the Channel Control Structure
        5. 15.3.11.5 Start the Transfer
        6. 15.3.11.6 Software Considerations
    4. 15.4 DMA Registers
  18. 16Advanced Encryption Standard (AES)
    1. 16.1 Introduction
      1. 16.1.1 AES Performance
    2. 16.2 Functional Description
      1. 16.2.1 Reset Considerations
      2. 16.2.2 Interrupt and Event Support
        1. 16.2.2.1 Interrupt Events and Requests
        2. 16.2.2.2 Connection to Event Fabric
      3. 16.2.3 µDMA
        1. 16.2.3.1 µDMA Example
    3. 16.3 Encryption and Decryption Configuration
      1. 16.3.1  CBC-MAC (Cipher Block Chaining-Message Authentication Code)
      2. 16.3.2  CBC (Cipher Block Chaining) Encryption
      3. 16.3.3  CBC Decryption
      4. 16.3.4  CTR (Counter) Encryption/Decryption
      5. 16.3.5  ECB (Electronic Code Book) Encryption
      6. 16.3.6  ECB Decryption
      7. 16.3.7  CFB (Cipher Feedback) Encryption
      8. 16.3.8  CFB Decryption
      9. 16.3.9  OFB (Open Feedback) Encryption
      10. 16.3.10 OFB Decryption
      11. 16.3.11 PCBC (Propagating Cipher Block Chaining) Encryption
      12. 16.3.12 PCBC Decryption
      13. 16.3.13 CTR-DRBG (Counter-Deterministic Random Bit Generator)
      14. 16.3.14 CCM
    4. 16.4 AES Registers
  19. 17Analog to Digital Converter (ADC)
    1. 17.1 Overview
    2. 17.2 Block Diagram
    3. 17.3 Functional Description
      1. 17.3.1  ADC Core
      2. 17.3.2  Voltage Reference Options
      3. 17.3.3  Resolution Modes
      4. 17.3.4  ADC Clocking
      5. 17.3.5  Power-Down Behavior
      6. 17.3.6  Sampling Trigger Sources and Sampling Modes
        1. 17.3.6.1 AUTO Sampling Mode
        2. 17.3.6.2 MANUAL Sampling Mode
      7. 17.3.7  Sampling Period
      8. 17.3.8  Conversion Modes
      9. 17.3.9  ADC Data Format
      10. 17.3.10 Status Register
      11. 17.3.11 ADC Events
        1. 17.3.11.1 CPU Interrupt Event Publisher (INT_EVENT0)
        2. 17.3.11.2 Generic Event Publisher (INT_EVENT1)
        3. 17.3.11.3 DMA Trigger Event Publisher (INT_EVENT2)
        4. 17.3.11.4 Generic Event Subscriber
    4. 17.4 Advanced Features
      1. 17.4.1 Window Comparator
      2. 17.4.2 DMA and FIFO Operation
        1. 17.4.2.1 DMA/CPU Operation in Non-FIFO Mode (FIFOEN=0)
        2. 17.4.2.2 DMA/CPU Operation in FIFO Mode (FIFOEN=1)
        3. 17.4.2.3 DMA/CPU Operation Summary Matrix
      3. 17.4.3 Ad-Hoc Single Conversion
    5. 17.5 ADC Registers
  20. 18I/O Controller (IOC)
    1. 18.1  Introduction
    2. 18.2  Block Diagram
    3. 18.3  I/O Mapping and Configuration
      1. 18.3.1 Basic I/O Mapping
      2. 18.3.2 Radio GPO
      3. 18.3.3 Pin Mapping
      4. 18.3.4 DTB Muxing
    4. 18.4  Edge Detection
    5. 18.5  GPIO
    6. 18.6  I/O Pins
    7. 18.7  Unused Pins
    8. 18.8  Debug Configuration
    9. 18.9  IOC Registers
    10. 18.10 GPIO Registers
  21. 19Universal Asynchronous Receiver/Transmitter (UART)
    1. 19.1 Introduction
    2. 19.2 Block Diagram
    3. 19.3 Functional Description
      1. 19.3.1 Transmit and Receive Logic
      2. 19.3.2 Baud Rate Generation
      3. 19.3.3 FIFO Operation
        1. 19.3.3.1 FIFO Remapping
      4. 19.3.4 Data Transmission
      5. 19.3.5 Flow Control
      6. 19.3.6 IrDA Encoding and Decoding
      7. 19.3.7 Interrupts
      8. 19.3.8 Loopback Operation
    4. 19.4 Interface to µDMA
    5. 19.5 Initialization and Configuration
    6. 19.6 UART Registers
  22. 20Serial Peripheral Interface (SPI)
    1. 20.1 Overview
      1. 20.1.1 Features
      2. 20.1.2 Block Diagram
    2. 20.2 Signal Description
    3. 20.3 Functional Description
      1. 20.3.1  Clock Control
      2. 20.3.2  FIFO Operation
        1. 20.3.2.1 Transmit FIFO
        2. 20.3.2.2 Repeated Transmit Operation
        3. 20.3.2.3 Receive FIFO
        4. 20.3.2.4 FIFO Flush
      3. 20.3.3  Interrupts
      4. 20.3.4  Data Format
      5. 20.3.5  Delayed Data Sampling
      6. 20.3.6  Chip Select Control
      7. 20.3.7  Command Data Control
      8. 20.3.8  Protocol Descriptions
        1. 20.3.8.1 Motorola SPI Frame Format
        2. 20.3.8.2 Texas Instruments Synchronous Serial Frame Format
        3. 20.3.8.3 MICROWIRE Frame Format
      9. 20.3.9  CRC Configuration
      10. 20.3.10 Auto CRC Functionality
      11. 20.3.11 Auto Header Functionality
      12. 20.3.12 SPI Status
      13. 20.3.13 Debug Halt
    4. 20.4 µDMA Operation
    5. 20.5 Initialization and Configuration
    6. 20.6 SPI Registers
  23. 21Inter-Integrated Circuit (I2C)
    1. 21.1 Introduction
    2. 21.2 Block Diagram
    3. 21.3 Functional Description
      1. 21.3.1 Functional Overview
        1. 21.3.1.1 Start and Stop Conditions
        2. 21.3.1.2 Data Format with 7-Bit Address
        3. 21.3.1.3 Data Validity
        4. 21.3.1.4 Acknowledge
        5. 21.3.1.5 Arbitration
      2. 21.3.2 Available Speed Modes
      3. 21.3.3 Interrupts
        1. 21.3.3.1 I2C Controller Interrupts
        2. 21.3.3.2 I2C Target Interrupts
      4. 21.3.4 Loopback Operation
      5. 21.3.5 Command Sequence Flow Charts
        1. 21.3.5.1 I2C Controller Command Sequences
        2. 21.3.5.2 I2C Target Command Sequences
    4. 21.4 Initialization and Configuration
    5. 21.5 I2C Registers
  24. 22Radio
    1. 22.1 Introduction
    2. 22.2 Block Diagram
    3. 22.3 Overview
      1. 22.3.1 Radio Sub-Domains
      2. 22.3.2 Radio RAMs
      3. 22.3.3 Doorbell (DBELL)
        1. 22.3.3.1 Interrupts
        2. 22.3.3.2 GPIO Control
        3. 22.3.3.3 SYSTIM Interface
    4. 22.4 Radio Usage Model
      1. 22.4.1 CRC and Whitening
    5. 22.5 LRFDDBELL Registers
    6. 22.6 LRFDRXF Registers
    7. 22.7 LRFDTXF Registers
  25. 23Revision History

14.2.1 BATMON

The battery monitor is a 7-bit SAR-like ADC running at 125kHz that performs alternate measurements of the supply voltage and the temperature. When the battery monitor has settled on the first measurement, the ADC stops working in SAR mode and starts linear tracking of voltage and temperature. A small digital core transforms these measurements to voltage and temperature in °C, which are read directly from the PMUD:BAT and PMUD:TEMP registers.

When a change in supply voltage or temperature is detected, the battery monitor solely tracks the voltage until the voltage has settled on a new constant level. The resolution of the ADC and the 125 kHz clock speed limits the battery monitor's capability of measuring voltage spikes. Due to the battery monitor not only alternating between temperature and battery voltage but also between checking if there has been a positive or negative change since the last read, there can be a delay of 6 clock cycles between a voltage dip and the time when the ADC can detect that the temperature or voltage has changed. Due to the prioritization of voltage tracking upon detection of voltage changes, temperature changes can be detected with more delays if the voltage is also changing at the same time. This is important to keep in mind because the battery monitor is designed to measure the battery voltage; the battery monitor is not designed to measure voltage spurs due to short periods of higher current consumption.

The module also includes an event register, PMUD.EVENT, which includes six event bits:

  • PMUD.EVENT[5] TEMP_UPDATE bit: indicates that the temperature has changed.
  • PMUD.EVENT[4] BATT_UPDATE bit: indicates that the voltage has changed.
  • PMUD.EVENT[3] TEMP_BELOW_LL bit: indicates that the temperature is below the lower limit value that is set in the PMUD.TEMPLL register.
  • PMUD.EVENT[2] TEMP_OVER_UL bit: indicates that the temperature is over the upper limit value that is set in the PMUD.TEMPUL register.
  • PMUD.EVENT[1] BATT_BELOW_LL bit: indicates that the voltage is below the lower limit value that is set in the PMUD:BATTLL register.
  • PMUD.EVENT[0] BATT_OVER_UL bit: indicates that the voltage is over the upper limit value that is set in the PMUD.BATTUL register.

These events must be cleared by writing to the PMUD:EVENT register. The events are asserted again if the conditions for the events are met (assertion of the new events takes precedence over the clearing of the events). In addition to the individual events listed previously, the battery monitor module has a combined event that is connected to the CPU as an interrupt line. The mask register, PMUD.EVENTMASK, can be used to select which of the events in PMUD.EVENT contribute to the combined event. This combined event is connected to the AON event fabric. For details, see Section 4.3.
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