SWRA672 May 2020 AWR6843AOP , IWR6843AOP
Heatsink with fins will provide further improvement in thermal performance for the sensor at the expense of larger surface area and complexity in the heatsink design. Fin configuration provides larger surface area to dissipate the heat. In general, the larger the surface area, the better the heat sinking capabilities. This experiment and measurement were done on one of the older version of AoP board.