Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

The die markings do not indicate the silicon revision. However, customers can determine the silicon revision by one of the following methods:

1. TI provided software functions in chipinfo.c:
   • HwRevision_t ChipInfo_GetHwRevision( void )
   • Returns: chip HW revision
   • HWREV_1_1 is returned for CC2651R3SIPA revision B.

    

2. SmartRF™ Studio:
   • When connecting to a CC2651R3SIPA device, the version number is shown in the lower-left corner (see Figure 2-2).
   • Customers can also read out the chip revision using SmartRF^™ Studio version 2.10.0 or later.
   Figure 2-2 Device Identification with SmartRF™ Studio
3. Package label:
   • The die revision name is shown on the tape and reel label as shown in the example label in Figure 2-3.
   • Entry (2P) lists the revision.
   Figure 2-3 Sample Product Shipping Label for the CC2651R3SIPA Device