TIDT409 September   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Required Equipment
    3. 1.3 Dimensions
  6. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Images
    4. 2.4 Bode Plots
    5. 2.5 EMI
  7. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Output Voltage Ripple

Thermal Images

The thermal images are shown in Figure 2-2 through Figure 2-5. The ambient temperature is 25°C, and the thermal images were taken with a 14V input. The controller was operated for approximately 30 minutes before thermal images were taken to verify the thermal steady state was reached.

The board copper of the top and bottom layers is 2oz, and the copper of the middle layers is 1oz.

PMP41092 Top Side Thermal Image, VPA_BUS =
                            VPB_BUS = 5V, IPA_BUS = IPB_BUS =
                        3AFigure 2-2 Top Side Thermal Image, VPA_BUS = VPB_BUS = 5V, IPA_BUS = IPB_BUS = 3A
PMP41092 Top Side Thermal Image, VPA_BUS =
                            VPB_BUS = 9V, IPA_BUS = IPB_BUS =
                        3AFigure 2-3 Top Side Thermal Image, VPA_BUS = VPB_BUS = 9V, IPA_BUS = IPB_BUS = 3A
PMP41092 Top Side Thermal Image, VPA_BUS =
                            VPB_BUS = 15V, IPA_BUS = IPB_BUS =
                        2AFigure 2-4 Top Side Thermal Image, VPA_BUS = VPB_BUS = 15V, IPA_BUS = IPB_BUS = 2A
PMP41092 Top Side Thermal Image, VPA_BUS =
                            VPB_BUS = 20V, IPA_BUS = IPB_BUS =
                        1.5AFigure 2-5 Top Side Thermal Image, VPA_BUS = VPB_BUS = 20V, IPA_BUS = IPB_BUS = 1.5A