TIDUCL3 February 2017
- 1 Overview
- 2 Resources
- 3 Features
- 4 Applications
- 5 Design Images
- 6 System Overview
-
7 System Design Theory
- 7.1 PCB and Form Factor
- 7.2 Optimizing Board Performance Based on LED String Voltage and Current
- 7.3 Switching Frequency
- 7.4 Output Overvoltage Protection (OVP)
- 7.5 Current Monitoring (IMON)
- 7.6 Thermal Foldback
- 7.7 Clock Generation (PWM)
- 7.8 Onboard Supply and Setting Duty Cycle
- 7.9 Buffering, Averaging, and Filtering
- 7.10 Boost Converter
- 8 Getting Started Hardware
- 9 Testing and Results
- 10Design Files
- 11Related Documentation
- 12About the Author
7.6.1.2 Changing Slope of Thermal Foldback
A limitation of this TI Design is that the thermal response will always follow the slope of the LMT87-Q1, –13.6 mV. However, thanks to TI's broad portfolio of temperature sensors, changing the slope of the line is simple. Specifically, the LM94021-Q1 can configure its slope from one of the four shown in Figure 12.
Figure 12. Different Slopes of LM94021-Q1