TIDUCL3 February   2017

1. 1 Overview
2. 2 Resources
3. 3 Features
4. 4 Applications
5. 5 Design Images
6. 6 System Overview
   1. 6.1 System Description
   2. 6.2 Key System Specifications
   3. 6.3 Block Diagram
   4. 6.4 Highlighted Products
      1. 6.4.1 LMT87-Q1
      2. 6.4.2 TLC555-Q1
      3. 6.4.3 OPA2377-Q1
      4. 6.4.4 TL431-Q1
      5. 6.4.5 TPS92691-Q1
7. 7 System Design Theory
   1. 7.1  PCB and Form Factor
   2. 7.2  Optimizing Board Performance Based on LED String Voltage and Current
   3. 7.3  Switching Frequency
   4. 7.4  Output Overvoltage Protection (OVP)
   5. 7.5  Current Monitoring (IMON)
   6. 7.6  Thermal Foldback
      1. 7.6.1 Changing Thermal Foldback Response
         1. 7.6.1.1 Changing Starting Point for Thermal Foldback
         2. 7.6.1.2 Changing Slope of Thermal Foldback
         3. 7.6.1.3 Constant Current at High Temperatures
      2. 7.6.2 Thermal Foldback Without PWM Dimming
   7. 7.7  Clock Generation (PWM)
   8. 7.8  Onboard Supply and Setting Duty Cycle
   9. 7.9  Buffering, Averaging, and Filtering
   10. 7.10 Boost Converter
8. 8 Getting Started Hardware
   1. 8.1 Hardware
   2. 8.2 LED Selection
   3. 8.3 J3, LED+, LED– (Boost)
   4. 8.4 J1, POS(+), NEG(–)
   5. 8.5 J4, Temperature Sensor Connection
   6. 8.6 Duty Cycle Adjust
9. 9 Testing and Results
   1. 9.1 Duty Cycle Accuracy
   2. 9.2 Thermal Foldback Testing
   3. 9.3 EMI Testing
   4. 9.4 Accuracy Calculation
10. 10Design Files
    1. 10.1 Schematics
    2. 10.2 Bill of Materials
    3. 10.3 PCB Layout Recommendations
       1. 10.3.1 Layout Prints
    4. 10.4 Altium Project
    5. 10.5 Gerber Files
    6. 10.6 Assembly Drawings
11. 11Related Documentation
    1. 11.1 Trademarks
12. 12About the Author