TIDUEP0 May 2020
- Description
- Resources
- Features
- Applications
- 1Design Images
- 2System Description
-
3System Overview
- 3.1 Block Diagram
- 3.2 Design Considerations
- 3.3
Highlighted Products
- 3.3.1 TPD4E05U06 4-Channel Ultra-Low-Capacitance IEC ESD Protection Diode
- 3.3.2 TPD2EUSB30 2-Channel ESD Solution for SuperSpeed USB 3.0 Interface
- 3.3.3 2.3.3 HD3SS3220 10Gbps USB 3.1 USB Type-C 2:1 MUX With DRP Controller
- 3.3.4 TPS54218 2.95V to 6V Input, 2A Synchronous Step-Down SWIFT™ Converter
- 3.3.5 TPS54318 2.95V to 6V Input, 3A Synchronous Step-Down SWIFT™ Converter
- 3.3.6 CSD19538Q3A 100V, N ch NexFET MOSFET™, single SON3x3, 49mOhm
- 3.3.7 LM3488 2.97V to 40V Wide Vin Low-Side N-Channel Controller for Switching Regulators
- 3.3.8 TPS61178 20-V Fully Integrated Sync Boost with Load Disconnect
- 3.3.9 LMZM23601 36-V, 1-A Step-Down DC-DC Power Module in 3.8-mm × 3-mm Package
- 3.3.10 TPS7A39 Dual, 150mA, Wide-Vin, Positive and Negative Low-Dropout (LDO) Voltage Regulator
- 3.3.11 TPS74201 Single-output 1.5-A LDO regulator, adjustable (0.8V to 3.3V), any or no cap, programmable soft start
- 3.3.12 LP5910 300-mA low-noise low-IQ low-dropout (LDO) linear regulator
- 3.3.13 LP5907 250-mA ultra-low-noise low-IQ low-dropout (LDO) linear
- 3.3.14 INA231 28V, 16-bit, i2c output current/voltage/power monitor w/alert in wcsp
- 3.4
System Design Theory
- 3.4.1 Input Section
- 3.4.2
Designing of SEPIC based High Voltage Supply
- 3.4.2.1 Basic Operation Principle of SEPIC Converter
- 3.4.2.2 Design of Dual SEPIC Supply using uncoupled inductors
- 3.4.2.3 Duty Cycle
- 3.4.2.4 Inductor Selection
- 3.4.2.5 Power MOSFET Selection
- 3.4.2.6 Output Diode Selection
- 3.4.2.7 Coupling Capacitor Selection
- 3.4.2.8 Output Capacitor Selection
- 3.4.2.9 Input Capacitor Selection
- 3.4.2.10 Programming the Output Voltage
- 3.4.3 Designing the Low Voltage Power Supply
- 3.4.4 Designing the TPS54218 through Webench Power Designer
- 3.4.5 ± 5V Transmit Supply Generation
- 3.4.6 System Clock Synchronization
- 3.4.7 Power and data output connector
- 3.4.8 System Current and Power Monitoring
- 4Hardware, Software, Testing Requirements, and Test Results
- 5Layout Guidelines
- 6Design Files
- 7Software Files
- 8Related Documentation
- 9About the Author
4.1.1 Test Setup
Figure 24 shows the front and back images of the TIDA-010057 board. The EMI shield placed between the AFE and TIDA-010057 board will provide EMI reduction. The 2 connectors dock into the TX + RX board and the USB Type-C connector connects it to the PC or tablet. The TIDA-10057 reference design has been evaluated and characterized by using two boards. The first board is a passive connector board which docks on to the power board. The adapter board has connectors placed around it to connect to load when needed. Figure 25 and Figure 26 shows the top and bottom of the adapter board. Various signals are also taken out to pins as well to connect to MCU for I2C communication, providing clock for synchronization and so on.
The second board used for evaluation is TX+RX AFE board as discussed in Highly Integrated Signal chain Solutions TX7332 and AFE5832LP for Smart Ultrasound Proves application note. The complete system is powered through a Type-C connector with computer on the other side with required softwares installed. For software information and other detailed implementation, please visit the webpage of the devices TX7332 and AFE5832 and go to request access now.