TIDUF99 November   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 LMG2100R026
      3. 2.3.3 TMCS1127
      4. 2.3.4 LM5164
      5. 2.3.5 LM74610-Q1
      6. 2.3.6 AFE031
      7. 2.3.7 CC1352P7
  9. 3System Design Theory
    1. 3.1 MPPT Operation
    2. 3.2 Power Optimizer Function
      1. 3.2.1 Power Line Communication (PLC)
    3. 3.3 Four-Switch Buck-Boost Converter
    4. 3.4 Output Inductance
    5. 3.5 Input Capacitance
    6. 3.6 Current Sensor
      1. 3.6.1 Current Measurement Resolution
      2. 3.6.2 Current Sensor Power Dissipation
    7. 3.7 Switching Regulator
    8. 3.8 Bypass Circuit
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
    4. 4.4 Test Results
      1. 4.4.1 Short Mode Test Result
      2. 4.4.2 Switching Mode Test Result
      3. 4.4.3 Bypass Circuit Test Results
      4. 4.4.4 PLC Test Results
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

Four-Switch Buck-Boost Converter

Table 3-1 Specifications for Four-Switch Buck-Boost Converter
PARAMETERSPECIFICATIONSUNIT
Maximum input voltage80V
Maximum output voltage80V
Maximum current18A

This reference design implements a 4-switch buck-boost topology to step up or step down the panel current to string current, so this reference design can be used in many applications that need to operate module-level optimization.

This topology can also be configured to a buck topology by using a bypass resistor to bypass the upper switch of the boost side. This bypass resistor simplifies the design and implementation of both topologies.

TIDA-010949 Configurable Four-Switch Buck-Boost TopologyFigure 3-6 Configurable Four-Switch Buck-Boost Topology

A stack-carrier modulation is used to generate the PWMs for the 4-switch buck-boost topology, as shown in Figure 3-6.

The carrier of the buck stage and boost stage is stacked. The buck carrier amplitude is between 0 to 1.05, the boost carrier amplitude is between 0.95 to 2, so, naturally, these two carriers have an overlapping when the modulator is between 0.95 to 1.05. Thus, this modulation scheme can seamlessly change from buck mode to buck-boost mode and boost mode, as shown in Figure 3-7.

TIDA-010949 Four Switch Buck-Boost Topology Modulation SchemeFigure 3-7 Four Switch Buck-Boost Topology Modulation Scheme

Adjusting the carrier starting point in C2000 causes a loss of PWM resolution, if using the theoretical implementation, then the PWM resolution can lose almost 50%, this reduces the performance of the converter. So in software, this is realized by adjusting the modulator of the boost stage and buck stage, as shown in Figure 3-8, the carrier of boost and buck is still between 0–1, while the modulator is between 0–2. By simply multiplying the modulator of buck by 0.95, which is equivalent to multiplying the carrier of buck by 1.05. The boost stage is similar; first, subtract the modulator of boost by 0.95, and then, multiply the result by 0.95 to get the final modulator of the boost stage. In Equation 1 and Equation 2, Mbuck is the modulator of the buck stage, Mboost is the modulator of the boost stage:

Equation 1. Mbuck=Mloop×0.95
Equation 2. Mboost=(Mloop-0.95)×0.95
TIDA-010949 Four Switch Buck-Boost Topology Modulation Scheme Implemented in C2000™Figure 3-8 Four Switch Buck-Boost Topology Modulation Scheme Implemented in C2000™

To make this four-switch buck-boost power stage more compact and efficient, the LMG2100R026 half-bridge power stage is selected for this reference design for the high maximum VDS of 93V continuous, 100V pulsed rating, and low Qg and RDS(on) of 12nC and 2.6mΩ, respectively, at a gate voltage of 5V. Also, the 7.0mm × 4.5mm × 0.89mm lead-free package saves a lot of PCB area, and this package is optimized for a smaller high-frequency current loop to provide the very small ringing during the switching period. This is a desirable design for a compact, high power density, and high-efficiency power optimizer of the medium power rating.