ZHCS240C December   2012  – June 2016 BQ27530-G1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Supply Current
    6. 6.6  Digital Input and Output DC Characteristics
    7. 6.7  Power-on Reset
    8. 6.8  2.5-V LDO Regulator
    9. 6.9  Internal Clock Oscillators
    10. 6.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 6.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 6.12 Data Flash Memory Characteristics
    13. 6.13 I2C-Compatible Interface Communication Timing Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Functional Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
        1. 7.4.1.1 BAT INSERT CHECK Mode
        2. 7.4.1.2 NORMAL Mode
        3. 7.4.1.3 SLEEP Mode
      2. 7.4.2 SLEEP+ Mode
      3. 7.4.3 HIBERNATE Mode
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
      2. 7.5.2 Control(): 0x00/0x01
      3. 7.5.3 Communications
        1. 7.5.3.1 I2C Interface
        2. 7.5.3.2 I2C Time Out
        3. 7.5.3.3 I2C Command Waiting Time
        4. 7.5.3.4 I2C Clock Stretching
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VREGIN Regulator input range –0.3 to 5.5 5.5 V
–0.3 6 (2) V
VCE CE input pin –0.3 VREGIN + 0.3 V
VCC Supply voltage range –0.3 2.75 V
VIOD Open-drain I/O pins (SDA, SCL, SOC_INT) –0.3 5.5 V
VBAT BAT input pin –0.3 5.5 V
–0.3 6 (2) V
VI Input voltage range to all other pins
(BI/TOUT, TS, SRP, SRN, BSDA, BSCL)		 –0.3 VCC + 0.3 V
TA Operating free-air temperature range –40 85 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin(1) ±1500 V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins(1) ±2000
Charged device model(CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1) bq27530-G1 UNIT
YZF (DSBGA)
15 PINS
RθJA Junction-to-ambient thermal resistance 70 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17 °C/W
RθJB Junction-to-board thermal resistance 20 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 18 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.4 Recommended Operating Conditions

TA = –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VREGIN Supply voltage No operating restrictions 2.8 4.5 V
No flash writes 2.45 2.8
CREGIN External input capacitor for internal LDO between REGIN and VSS Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. 0.1 μF
CLDO25 External output capacitor for internal LDO between VCC and VSS 0.47 1 μF
tPUCD Power-up communication delay 250 ms

6.5 Supply Current

TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC (1) Normal operating-mode current Fuel gauge in NORMAL mode
ILOAD > Sleep current 		118 μA
ISLP+ (1) Sleep+ operating mode current Fuel gauge in SLEEP+ mode
ILOAD < Sleep current 		62 μA
ISLP (1) Low-power storage-mode current Fuel gauge in SLEEP mode
ILOAD < Sleep current 		23 μA
IHIB (1) Hibernate operating-mode current Fuel gauge in HIBERNATE mode
ILOAD < Hibernate current 		8 μA
(1) Specified by design. Not production tested.

6.6 Digital Input and Output DC Characteristics

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOL Output voltage, low (SCL, SDA, SOC_INT, BSDA, BSCL) IOL = 3 mA 0.4 V
VOH(PP) Output voltage, high (BSDA, BSCL) IOH = –1 mA VCC – 0.5 V
VOH(OD) Output voltage, high (SDA, SCL, SOC_INT) External pullup resistor connected to VCC VCC – 0.5
VIL Input voltage, low (SDA, SCL) –0.3 0.6 V
Input voltage, low (BI/TOUT) BAT INSERT CHECK MODE active –0.3 0.6
VIH Input voltage, high (SDA, SCL) 1.2 V
Input voltage, high (BI/TOUT) BAT INSERT CHECK MODE active 1.2 VCC + 0.3
VIL(CE) Input voltage, low (CE) VREGIN = 2.8 to 4.5V 0.8 V
VIH(CE) Input voltage, high (CE) 2.65
Ilkg (1) Input leakage current (I/O pins) 0.3 μA
(1) Specified by design. Not production tested.

6.7 Power-on Reset

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going battery voltage input at VCC 2.05 2.15 2.20 V
VHYS Power-on reset hysteresis 115 mV

6.8 2.5-V LDO Regulator

TA = –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIREG25 Regulator output voltage VCC 2.8 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA(1) 2.3 2.5 2.6 V
2.45 V ≤ VREGIN < 2.8 V (low battery), IOUT ≤ 3mA 2.3 V
(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.

6.9 Internal Clock Oscillators

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOSC High frequency oscillator 8.389 MHz
fLOSC Low frequency oscillator 32.768 kHz

6.10 ADC (Temperature and Cell Measurement) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VADC1 Input voltage range (TS) VSS – 0.125 2 V
VADC2 Input voltage range (BAT) VSS – 0.125 5 V
VIN(ADC) Input voltage range 0.05 1 V
GTEMP Internal temperature sensor voltage gain –2 mV/°C
tADC_CONV Conversion time 125 ms
Resolution 14 15 bits
VOS(ADC) Input offset 1 mV
ZADC1 (1) Effective input resistance (TS) 8 MΩ
ZADC2 (1) Effective input resistance (BAT) bq27530-G1 not measuring cell voltage 8 MΩ
bq27530-G1 measuring cell voltage 100 kΩ
Ilkg(ADC) (1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

6.11 Integrating ADC (Coulomb Counter) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VSR Input voltage range,
V(SRP) and V(SRN) 		VSR = V(SRP) – V(SRN) –0.125 0.125 V
tSR_CONV Conversion time Single conversion 1 s
Resolution 14 15 bits
VOS(SR) Input offset 10 μV
INL Integral nonlinearity error ±0.007% ±0.034% FSR
ZIN(SR) (1) Effective input resistance 2.5 MΩ
Ilkg(SR)(1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

6.12 Data Flash Memory Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tDR (1) Data retention 10 Years
Flash-programming write cycles(1) 20,000 Cycles
tWORDPROG (1) Word programming time 2 ms
ICCPROG (1) Flash-write supply current 5 10 mA
tDFERASE (1) Data flash master erase time 200 ms
tIFERASE (1) Instruction flash master erase time 200 ms
tPGERASE (1) Flash page erase time 20 ms
(1) Specified by design. Not production tested

6.13 I2C-Compatible Interface Communication Timing Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
MIN NOM MAX UNIT
tr SCL/SDA rise time 300 ns
tf SCL/SDA fall time 300 ns
tw(H) SCL pulse duration (high) 600 ns
tw(L) SCL pulse duration (low) 1.3 μs
tsu(STA) Setup for repeated start 600 ns
td(STA) Start to first falling edge of SCL 600 ns
tsu(DAT) Data setup time 100 ns
th(DAT) Data hold time 0 ns
tsu(STOP) Setup time for stop 600 ns
t(BUF) Bus free time between stop and start 66 μs
fSCL Clock frequency (1) 400 kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (Refer to I2C Interface and I2C Command Waiting Time.)
bq27530-G1 i2c_timing_diagram.gif Figure 1. I2C-compatible Interface Timing Diagrams

6.14 Typical Characteristics

bq27530-G1 D001_SLUSBU6.gif
Figure 2. Regulator Output Voltage vs. Temperature
bq27530-G1 D003_SLUSBU6.gif
Figure 4. Low-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D002_SLUSBU6.gif
Figure 3. High-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D004_SLUSBU6.gif
Figure 5. Reported Internal Temperature Measurement vs. Temperature
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