To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2405x, with short trace runs to both IN, OUT, and GND (thermal pad).

• All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
• The high current charge paths into IN terminal and from the OUT terminal must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces
• The BQ2404x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. It is best to use multiple 10mil vias in the power pad of the IC and close enough to conduct the heat to the bottom ground plane. The bottom ground plane should avoid traces that “cut off” the thermal path. The thinner the PCB the less temperature rise. The EVM PCB has a thickness of 0.031 inches and uses 2 oz. (2.8mil thick) copper on top and bottom, and is a good example of optimal thermal performance.