ZHCS477K September   2011  – August 2022 BQ294502 , BQ294504 , BQ294506 , BQ294512 , BQ294522 , BQ294524 , BQ294532 , BQ294533 , BQ294534 , BQ294582 , BQ294592

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sense Positive Input for VX
      2. 8.3.2 Output Drive, OUT
      3. 8.3.3 Supply Input, VDD
      4. 8.3.4 Thermal Pad, PWRPAD
    4. 8.4 Device Functional Modes
      1. 8.4.1 NORMAL Mode
      2. 8.4.2 OVERVOLTAGE Mode
      3. 8.4.3 Customer Test Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)BQ2945xyUNIT
DRV (SON)
6 PINS
RθJAJunction-to-ambient thermal resistance186.4°C/W
RθJC(top)Junction-to-case(top) thermal resistance90.4°C/W
RθJBJunction-to-board thermal resistance110.7°C/W
ψJTJunction-to-top characterization parameter96.7°C/W
ψJBJunction-to-board characterization parameter90°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report.
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