ZHCS599B December 2011 – August 2015 TPS7A8101
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Voltage | IN | –0.3 | 7 | V |
FB, NR | –0.3 | 3.6 | ||
EN | –0.3 | VIN + 0.3(2) | ||
OUT | –0.3 | 7 | ||
Current | OUT | Internally Limited | A | |
Temperature | Operating virtual junction, TJ | –55 | 150 | °C |
Storage, Tstg | –55 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | ±2000 | V | |
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | ±500 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VI | Input voltage | 2.2 | 6.5 | V |
IO | Output current | 0 | 1 | A |
TA | Operating free air temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPS7A8101 | UNIT | |
---|---|---|---|
DRV (SON) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 47.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 53.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 23.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 1 | °C/W |
ψJB | Junction-to-board characterization parameter | 23.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.4 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
---|---|---|---|---|---|---|---|---|
VIN | Input voltage range(1) | 2.2 | 6.5 | V | ||||
VNR | Internal reference | 0.79 | 0.8 | 0.81 | V | |||
VOUT | Output voltage range | 0.8 | 6 | V | ||||
Output accuracy(2) | VOUT + 0.5 V ≤ VIN ≤ 6 V, VIN ≥ 2.5 V, 100 mA ≤ IOUT ≤ 500 mA, 0°C ≤ TJ ≤ 85°C |
-2% | 2% | |||||
VOUT + 0.5 V ≤ VIN ≤ 6.5 V, VIN ≥ 2.2 V, 100 mA ≤ IOUT ≤ 1 A |
–3% | ±0.3% | 3% | |||||
ΔVO(ΔVI) | Line regulation | VOUT(NOM) + 0.5 V ≤ VIN ≤ 6.5 V, VIN ≥ 2.2 V, IOUT = 100 mA |
150 | μV/V | ||||
ΔVO(ΔIL) | Load regulation | 100 mA ≤ IOUT ≤ 1 A | 2 | μV/mA | ||||
VDO | Dropout voltage(3) | VOUT + 0.5 V ≤ VIN ≤ 6.5 V, VIN ≥ 2.2 V, IOUT = 500 mA, VFB = GND or VSNS = GND |
250 | mV | ||||
VOUT + 0.5 V ≤ VIN ≤ 6.5 V, VIN ≥ 2.5 V, IOUT = 750 mA, VFB = GND or VSNS = GND |
350 | |||||||
VOUT + 0.5 V ≤ VIN ≤ 6.5 V, VIN ≥ 2.5 V, IOUT = 1 A, VFB = GND or VSNS = GND |
500 | |||||||
ILIM | Output current limit | VOUT = 0.85 × VOUT(NOM), VIN ≥ 3.3 V | 1100 | 1400 | 2000 | mA | ||
IGND | Ground pin current | IOUT = 1 mA | 60 | 100 | μA | |||
IOUT = 1 A | 350 | |||||||
ISHDN | Shutdown current (IGND) | VEN ≤ 0.4 V, VIN ≥ 2.2 V, RL = 1 kΩ, 0°C ≤ TJ ≤ 85°C |
0.2 | 2 | μA | |||
IFB | Feedback pin current | VIN = 6.5 V, VFB = 0.8 V | 0.02 | 1 | μA | |||
PSRR | Power-supply rejection ratio | VIN = 4.3 V, VOUT = 3.3 V, IOUT = 750 mA |
f = 100 Hz | 80 | dB | |||
f = 1 kHz | 82 | |||||||
f = 10 kHz | 78 | |||||||
f = 100 kHz | 60 | |||||||
f = 1 MHz | 54 | |||||||
Vn | Output noise voltage | BW = 100 Hz to 100 kHz, VIN = 3.8 V, VOUT = 3.3 V, IOUT = 100 mA, CNR = CBYPASS = 470 nF |
23.5 | μVRMS | ||||
VEN(HI) | Enable high (enabled) | 2.2 V ≤ VIN ≤ 3.6 V, RL = 1 kΩ | 1.2 | V | ||||
3.6 V < VIN ≤ 6.5 V, RL = 1 kΩ | 1.35 | |||||||
VEN(LO) | Enable low (shutdown) | RL = 1 kΩ | 0 | 0.4 | V | |||
IEN(HI) | Enable pin current, enabled | VIN = VEN = 6.5 V | 0.02 | 1 | μA | |||
tSTR | Start-up time | VOUT(NOM) = 3.3 V, VOUT = 0% to 90% VOUT(NOM), RL = 3.3 kΩ, COUT = 10 μF, CNR = 470 nF |
80 | ms | ||||
UVLO | Undervoltage lockout | VIN rising, RL = 1 kΩ | 1.86 | 2 | 2.10 | V | ||
Hysteresis | VIN falling, RL = 1 kΩ | 75 | mV | |||||
TSD | Thermal shutdown temperature | Shutdown, temperature increasing | 160 | °C | ||||
Reset, temperature decreasing | 140 | °C | ||||||
TJ | Operating junction temperature | –40 | 125 | °C |
NOTE: The Y-axis shows 1% VO per division | ||
VO = 0.8 V | IO = 750 mA | |
NOTE: The Y-axis shows 1% VO per division |
IO = 1 A | ||
IO = 500 mA | ||
VI = 3.6 V | ||
VO = VI – 0.5 V |
VI – VO = 1 V | C(IN) = 0 F | C(OUT) = 10 µF |
C(NR) = C(BYPASS) = 470 nF |
VI – VO = 1 V | C(IN) = 0 F | C(OUT) = 10 µF |
C(NR) = C(BYPASS) = 470 nF |
IO = 100 mA | C(IN) = 0 F |
VI – VO = 0.5 V | C(OUT) = 10 µF | C(IN) = 10 µF | |
24.09 µVRMS (C(NR) = C(BYPASS) = 100 nF) | |||
23.54 µVRMS (C(NR) = C(BYPASS) = 470 nF) |
23.54 µVRMS (IO = 100 mA) | C(IN) = 10 µF | VI – VO = 0.5 V |
23.71 µVRMS (IO = 750 mA) | C(NR) = 470 nF | C(OUT) = 10 µF |
22.78 µVRMS (IO = 1 A) | C(BYPASS) = 470 nF |
Using the same value of C(NR) and C(BYPASS) in the X-Axis |
IO = 100 mA → 1 A → 100 mA | ||
RL = 33 Ω | C(NR) = 470 nF | C(BYPASS) = 470 nF | ||
C(OUT) = 10 µF | C(IN) = 10 µF | |||
(1) The internal reference requires approximately 80 ms of rampup time (see Start-Up) from the enable event; therefore, VO fully reaches the target output voltage of 3.3 V in 80 ms from start-up. |
NOTE: The Y-axis shows 1% VO per division | ||
VO = 0.8 V | IO = 5 mA | |
NOTE: The Y-axis shows 1% VO per division |
IO = 750 mA | ||
VI = 3.6 V | ||
VO = 0.8 V | IO = 750 mA | |
V(EN) = 0.4 V | ||
C(NR) = C(BYPASS) = 470 nF | C(OUT) = 10 µF | C(IN) = 0 F |
VI – VO = 0.5 V | C(IN) = 0 F | C(OUT) = 10 µF |
C(NR) = C(BYPASS) = 470 nF |
VI – VO = 0.5 V | C(IN) = 0 F | C(OUT) = 10 µF |
C(NR) = C(BYPASS) = 470 nF |
IO = 750 mA | C(IN) = 0 F |
25.89 µVRMS (VO = 1.8 V) | C(IN) = 10 µF | VI – VO = 0.5 V |
23.54 µVRMS (VO = 2.5 V) | C(NR) = 470 nF | C(OUT) = 10 µF |
23.54 µVRMS (VO = 3.3 V) | C(BYPASS) = 470 nF |
23.54 µVRMS (CO = 10 µF) | C(IN) = 10 µF | VI – VO = 0.5 V |
23.91 µVRMS (CO = 22 µF) | C(NR) = 470 nF | C(OUT) = 10 µF |
22.78 µVRMS (CO = 100 µF) | C(BYPASS) = 470 nF |
VI = 3.8 V → 4.8 V → 3.8 V | ||
IO = 500 mA |
RL = 33 Ω | C(NR) = 470 nF | C(BYPASS) = 470 nF |
C(OUT) = 10 µF | C(IN) = 10 µF |