ZHCS826C January   2012  – November 2023 TPS40170-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  LDO Linear Regulators and Enable
      2. 6.3.2  Input Undervoltage Lockout (UVLO)
      3. 6.3.3  Equations for Programming the Input UVLO
      4. 6.3.4  Overcurrent Protection and Short-Circuit Protection (OCP and SCP)
      5. 6.3.5  Oscillator and Voltage Feed-Forward
        1. 6.3.5.1 Calculating the Timing Resistance (RRT)
      6. 6.3.6  Feed-Forward Oscillator Timing Diagram
      7. 6.3.7  Soft-Start and Fault-Logic
        1. 6.3.7.1 Soft-Start During Overcurrent Fault
        2. 6.3.7.2 Equations for Soft-Start and Restart Time
      8. 6.3.8  Overtemperature Fault
      9. 6.3.9  Tracking
      10. 6.3.10 Adaptive Drivers
      11. 6.3.11 Start-Up Into Pre-Biased Output
      12. 6.3.12 31
      13. 6.3.13 Power Good (PGOOD)
      14. 6.3.14 PGND and AGND
      15. 6.3.15 Bootstrap Capacitor
      16. 6.3.16 Bypass and Filtering
    4. 6.4 Device Functional Modes
      1. 6.4.1 Frequency Synchronization
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Select A Switching Frequency
        2. 7.2.2.2  Inductor Selection (L1)
        3. 7.2.2.3  Output Capacitor Selection (C9)
        4. 7.2.2.4  Peak Current Rating of Inductor
        5. 7.2.2.5  Input Capacitor Selection (C1, C6)
        6. 7.2.2.6  MOSFET Switch Selection (Q1, Q2)
        7. 7.2.2.7  Timing Resistor (R7)
        8. 7.2.2.8  UVLO Programming Resistors (R2, R6)
        9. 7.2.2.9  Bootstrap Capacitor (C7)
        10. 7.2.2.10 VIN Bypass Capacitor (C18)
        11. 7.2.2.11 VBP Bypass Capacitor (C19)
        12. 7.2.2.12 SS Timing Capacitor (C15)
        13. 7.2.2.13 ILIM Resistor (R19, C17)
        14. 7.2.2.14 SCP Multiplier Selection (R5)
        15. 7.2.2.15 Feedback Divider (R10, R11)
        16. 7.2.2.16 Compensation: (R4, R13, C13, C14, C21)
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bootstrap Resistor
      2. 7.3.2 SW-Node Snubber Capacitor
      3. 7.3.3 Input Resistor
      4. 7.3.4 LDRV Gate Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

GUID-27E05E70-79C2-485B-BFDD-4CDD03ED48D0-low.gif Figure 4-1 RGY PACKAGEQFN-20(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
AGND 9 — Analog signal ground. This pin must be electrically connected to power ground PGND externally.
BOOT 18 O Boot-capacitor node for high-side FET gate driver. The boot capacitor is connected from this pin to SW.
COMP 8 O Output of the internal error amplifier. The feedback loop compensation network is connected from this pin to the FB pin.
ENABLE 1 I This pin must be high for the device to be enabled. If this pin is pulled low, the device is put in a low-power-consumption shutdown mode.
FB 7 I Negative input to the error amplifier. The output voltage is fed back to this pin through a resistor-divider network.
HDRV 17 O Gate-driver output for the high-side FET.
ILIM 12 I A resistor from this pin to PGND sets the overcurrent limit. This pin provides source current used for the overcurrent-protection threshold setting.
LDRV 14 O Gate driver output for the low-side FET. Also, a resistor from this pin to PGND sets the multiplier factor to determine the short-circuit current limit. If no resistor is present, the multiplier defaults to 7 times the ILIM pin voltage.
M/S 3 I Primary- or secondary-mode selector pin for frequency synchronization. This pin must be tied to VIN for primary mode. In the secondary mode, this pin must be tied to AGND or left floating. If the pin is tied to AGND, the device synchronizes with a 180° phase shift. If the pin is left floating, the device synchronizes with a 0° phase shift.
PGND 13 — Power ground. This pin must externally connect to the AGND at a single point.
PGOOD 11 O Power-good indicator. This pin is an open-drain output pin, and TI recommends a 10-kΩ pullup resistor to be connected between this pin and VDD.
RT 4 I A resistor from this pin to AGND sets the oscillator frequency. Even if operating in secondary mode, it is required to have a resistor at this pin to set the free-running switching frequency.
SS 5 I Soft-start. A capacitor must be connected from this pin to AGND. The capacitor value sets the soft-start time.
SW 16 I This pin must connect to the switching node of the synchronous buck converter. The high-side and low-side FET current sensing are also done from this node.
SYNC 2 I/O Synchronization. This is a bidirectional pin used for frequency synchronization. In the primary mode, it is the SYNC output pin. In the secondary mode, it is a SYNC input pin. If unused, this pin can be left open.
TRK 6 I Tracking. External signal at this pin is used for output voltage tracking. This pin goes directly to the internal error amplifier as a positive reference. The lesser of the voltages between VTRK and the internal 600-mV reference sets the output voltage. If not used, this pin must be pulled up to VDD.
UVLO 20 I Undervoltage lockout. A resistor divider on this pin from VIN to AGND can be used to set the UVLO threshold.
VBP 15 O 8-V regulated output for gate driver. A ceramic capacitor with a value between 1 µF and 10 µF must be connected from this pin to PGND
VDD 10 O 3.3-V regulated output. A ceramic bypass capacitor with a value between 0.1 µF and 1 µF must be connected between this pin and the AGND pin and placed closely to this pin.
VIN 19 I Input voltage for the controller, which is also the input voltage for the dc-dc converter. A 1-µF bypass capacitor from this pin to AGND must be added and placed closed to VIN.
(1) I = input, O = output
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