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ZHCSB24F May 2013 – August 2018 TS3DV642

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TS3DV642	UNIT
		RUA
		42 PINS
R_θJA	Junction-to-ambient thermal resistance	31.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	16.2	°C/W
R_θJB	Junction-to-board thermal resistance	5.5	°C/W
ψ_JT	Junction-to-top characterization parameter	0.2	°C/W
ψ_JB	Junction-to-board characterization parameter	5.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	2.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.