ZHCSCV2C june   2014  – may 2023 TPS65263

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjusting the Output Voltage
      2. 8.3.2  Enable and Adjusting UVLO
      3. 8.3.3  Soft-Start Time
      4. 8.3.4  Power-Up Sequencing
      5. 8.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 8.3.6  Out-of-Phase Operation
      7. 8.3.7  Output Overvoltage Protection (OVP)
      8. 8.3.8  Pulse Skipping Mode (PSM)
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Overcurrent Protection
        1. 8.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 Power Good
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface Description
      2. 8.4.2 I2C Update Sequence
    5. 8.5 Register Maps
      1. 8.5.1 Register Description
      2. 8.5.2 VOUT1_SEL: Vout1 Voltage Selection Register (offset = 0x00H)
      3. 8.5.3 VOUT2_SEL: Vout2 Voltage Selection Register (offset = 0x01H)
      4. 8.5.4 VOUT3_SEL: Vout3 Voltage Selection Register (offset = 0x02H)
      5. 8.5.5 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      6. 8.5.6 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      7. 8.5.7 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      8. 8.5.8 SYS_STATUS: System Status Register (offset = 0x06H)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Loop Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

6 Pin Configuration and Functions

GUID-68AACD1B-B567-499B-88C9-18A19429D975-low.gif
(There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for optimal thermal performance.)
Figure 6-1 RHB Package32 PinTop View
Table 6-1 Pin Functions
PIN DESCRIPTION
NAME NO.
EN3 1 Enable for buck3. Float to enable. Can use this pin to adjust the input undervoltage lockout (UVLO) of buck3 with a resistor divider.
SDA 2 I2C interface data pin
SCL 3 I2C interface clock pin
AGND 4 Analog ground common to buck controllers and other analog circuits. It must be routed separately from high current power grounds to the (–) terminal of bypass capacitor of input voltage VIN.
VOUT2 5 Buck2 output voltage sense pin.
FB2 6 Feedback Kelvin sensing pin for buck2 output voltage. Connect this pin to buck2 resistor divider.
COMP2 7 Error amplifier output and Loop compensation pin for buck2. Connect a series resistor and capacitor to compensate the control loop of buck2 with peak current PWM mode.
SS2 8 Soft-start and tracking input for buck2. An internal 5uA pullup current source is connected to this pin. The soft-start time can be programmed by connecting a capacitor between this pin and ground.
BST2 9 Boot strapped supply to the high side floating gate driver in buck2. Connect a capacitor (recommend 47nF) from BST2 pin to LX2 pin.
LX2 10 Switching node connection to the inductor and bootstrap capacitor for buck2. The voltage swing at this pin is from a diode voltage below the ground up to PVIN2 voltage.
PGND2 11 Power ground connection of buck2. Connect PGND2 pin as close as practical to the (–) terminal of PVIN2 input ceramic capacitor.
PVIN2 12 Input power supply for buck2. Connect PVIN2 pin as close as practical to the (+) terminal of an input ceramic capacitor (suggest 10 µF).
PVIN3 13 Input power supply for buck3. Connect PVIN3 pin as close as practical to the (+) terminal of an input ceramic capacitor (suggest 10 µF).
PGND3 14 Power ground connection of buck3. Connect PGND3 pin as close as practical to the (–) terminal of PVIN3 input ceramic capacitor.
LX3 15 Switching node connection to the inductor and bootstrap capacitor for buck3. The voltage swing at this pin is from a diode voltage below the ground up to PVIN3 voltage.
BST3 16 Boot strapped supply to the high side floating gate driver in buck3. Connect a capacitor (recommend 47 nF) from BST3 pin to LX3 pin.
SS3 17 Soft-start and tracking input for buck3. An internal 5-µA pullup current source is connected to this pin. The soft-start time can be programmed by connecting a capacitor between this pin and ground.
COMP3 18 Error amplifier output and Loop compensation pin for buck3. Connect a series resistor and capacitor to compensate the control loop of buck3 with peak current PWM mode.
FB3 19 Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to buck3 resistor divider.
VOUT3 20 Buck3 output voltage sense pin.
VOUT1 21 Buck1 output voltage sense pin.
FB1 22 Feedback Kelvin sensing pin for buck1 output voltage. Connect this pin to buck1 resistor divider.
COMP1 23 Error amplifier output and Loop compensation pin for buck1. Connect a series resistor and capacitor to compensate the control loop of buck1 with peak current PWM mode.
SS1 24 Soft-start and tracking input for buck1. An internal 5-µA pullup current source is connected to this pin. The soft-start time can be programmed by connecting a capacitor between this pin and ground.
BST1 25 Boot strapped supply to the high side floating gate driver in buck1. Connect a capacitor (recommend 47 nF) from BST1 pin to LX1 pin.
LX1 26 Switching node connection to the inductor and bootstrap capacitor for buck1. The voltage swing at this pin is from a diode voltage below the ground up to PVIN1 voltage.
PGND1 27 Power ground connection of Buck1. Connect PGND1 pin as close as practical to the (–) terminal of PVIN1 input ceramic capacitor.
PVIN1 28 Input power supply for buck1. Connect PVIN1 pin as close as practical to the (+) terminal of an input ceramic capacitor (suggest 10 µF).
VIN 29 Buck controller power supply.
V7V 30 Internal LDO for gate driver and internal controller. Connect a 10-µF capacitor from the pin to power ground.
EN1 31 Enable for buck1. Float to enable. Can use this pin to adjust the input UVLO of buck1 with a resistor divider.
EN2 32 Enable for buck2. Float to enable. Can use this pin to adjust the input UVLO of buck2 with a resistor divider.
PAD — There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for optimal thermal performance.
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