The TPS65263 can be layout on 2-layer PCB, shown in Figure 9-26.

Layout is a critical portion of good power supply design. See Figure 9-26 for a PCB layout example. The top contains the main power traces for PVIN, VOUT, and LX. Also on the top layer are connections for the remaining pins of the TPS65263 and a large top side area filled with ground. The top layer ground area must be connected to the bottom layer ground using vias at the input bypass capacitor, the output filter capacitor and directly under the TPS65263 device to provide a thermal path from the exposed thermal pad land to ground. The bottom layer acts as ground plane connecting analog ground and power ground.

For operation at full rated load, the top side ground area together with the bottom side ground plane must provide adequate heat dissipating area. There are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help eliminate these problems, the PVIN pin must be bypassed to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric. Care must be taken to minimize the loop area formed by the bypass capacitor connections, the PVIN pins, and the ground connections. The VIN pin must also be bypassed to ground using a low ESR ceramic capacitor with X5R or X7R dielectric.

Because the LX connection is the switching node, the output inductor must be located close to the LX pins, and the area of the PCB conductor minimized to prevent excessive capacitive coupling. The output filter capacitor ground must use the same power ground trace as the PVIN input bypass capacitor. Try to minimize this conductor length while maintaining adequate width. The small signal components must be grounded to the analog ground path.

The FB and COMP pins are sensitive to noise so the resistors and capacitors must be located as close as possible to the IC and routed with minimal lengths of trace. The additional external components can be placed approximately as shown.