ZHCSD24B October   2014  – June 2024 TPS61169

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Soft Start-Up
      2. 6.3.2 Open LED Protection
      3. 6.3.3 Shutdown
      4. 6.3.4 Current Program
      5. 6.3.5 LED Brightness Dimming
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Thermal Foldback and Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation With CTRL
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Output Capacitor Selection
        4. 7.2.2.4 LED Current Set Resistor
        5. 7.2.2.5 Thermal Considerations
    3. 7.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.2.5 Thermal Considerations

The allowable IC junction temperature must be considered under normal operating conditions. This restriction limits the power dissipation of the TPS61169. The allowable power dissipation for the device can be determined by Equation 7:

Equation 7. TPS61169

where

  • TJ is allowable junction temperature given in recommended operating conditions
  • TA is the ambient temperature for the application
  • RθJA is the thermal resistance junction-to-ambient given in Power Dissipation Table

The TPS61169 device also features a thermal foldback function to reduce the thermal stress automatically.
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