| THERMAL METRIC(1) | TPS61169 | UNIT |
|---|
| DCK (SC70) |
|---|
| 5 PINS |
|---|
| RθJA | Junction-to-ambient thermal resistance(2) | 263.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance(3) | 76.1 | °C/W |
| RθJB | Junction-to-board thermal resistance(4) | 51.4 | °C/W |
| ψJT | Junction-to-top characterization parameter(5) | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter(6) | 50.7 | °C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA , using a procedure described in JESD51-2a (sections 6 and 7).