ZHCSD98A March   2013  – January 2015 LMT89

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT89 Transfer Function
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Conserving Power Dissipation With Shutdown
      2. 8.3.2 Analog-to-Digital Converter Input Stage
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

5 Pin Configuration and Functions

SC70-5 Top View
top_view_pack_number_nis176.gif

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 NC NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin.
2 GND GND Device substrate and die attach paddle, connect to power supply negative terminal. For optimum thermal conductivity to the PC board ground plane, pin 2 must be grounded. This pin may also be left floating.
3 VO Analog Output Temperature sensor analog output
4 V+ Power Positive power supply pin
5 GND GND Device ground pin, connect to power supply negative terminal.