ZHCSDQ0C March   2015  – August 2018 LP8758-B0

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化原理图
    1.     效率与输出电流 (VIN = 3.7V)
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Serial Bus Timing Parameter
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Buck Information
        1. 8.1.1.1 Operating Modes
        2. 8.1.1.2 Features
        3. 8.1.1.3 Programmability
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multi-Phase DC-DC Converters
        1. 8.3.1.1 Overview
        2. 8.3.1.2 Multi-Phase Operation and Phase Adding/Shedding
        3. 8.3.1.3 Transition Between PWM and PFM Modes
        4. 8.3.1.4 Multi-Phase Switcher Configurations
        5. 8.3.1.5 Buck Converter Load Current Measurement
        6. 8.3.1.6 Spread-Spectrum Mode
      2. 8.3.2 Power-Up
      3. 8.3.3 Regulator Control
        1. 8.3.3.1 Enabling and Disabling Regulator
        2. 8.3.3.2 Changing Output Voltage
      4. 8.3.4 Device Reset Scenarios
      5. 8.3.5 Diagnosis and Protection Features
        1. 8.3.5.1 Warnings for Diagnosis (Interrupt)
          1. 8.3.5.1.1 Output Current Limit
          2. 8.3.5.1.2 Thermal Warning
        2. 8.3.5.2 Protection (Regulator Disable)
          1. 8.3.5.2.1 Short-Circuit and Overload Protection
          2. 8.3.5.2.2 Thermal Shutdown
        3. 8.3.5.3 Fault (Power Down)
          1. 8.3.5.3.1 Undervoltage Lockout
      6. 8.3.6 Digital Signal Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 Start and Stop Conditions
        3. 8.5.1.3 Transferring Data
        4. 8.5.1.4 I2C-Compatible Chip Address
        5. 8.5.1.5 Auto Increment Feature
    6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1  DEV_REV
        2. 8.6.1.2  OTP_REV
        3. 8.6.1.3  BUCK0_CTRL1
        4. 8.6.1.4  BUCK0_CTRL2
        5. 8.6.1.5  BUCK1_CTRL2
        6. 8.6.1.6  BUCK2_CTRL2
        7. 8.6.1.7  BUCK3_CTRL2
        8. 8.6.1.8  BUCK0_VOUT
        9. 8.6.1.9  BUCK0_FLOOR_VOUT
        10. 8.6.1.10 BUCK0_DELAY
        11. 8.6.1.11 RESET
        12. 8.6.1.12 CONFIG
        13. 8.6.1.13 INT_TOP
        14. 8.6.1.14 INT_BUCK_0_1
        15. 8.6.1.15 INT_BUCK_2_3
        16. 8.6.1.16 TOP_STAT
        17. 8.6.1.17 BUCK_0_1_STAT
        18. 8.6.1.18 BUCK_2_3_STAT
        19. 8.6.1.19 TOP_MASK
        20. 8.6.1.20 BUCK_0_1_MASK
        21. 8.6.1.21 BUCK_2_3_MASK
        22. 8.6.1.22 SEL_I_LOAD
        23. 8.6.1.23 I_LOAD_2
        24. 8.6.1.24 I_LOAD_1
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application Components
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Input Capacitor Selection
          3. 9.2.2.1.3 Output Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

9.2.2 Detailed Design Procedure

The performance of the LP8758 device depends greatly on the care taken in designing the printed circuit board (PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended, while proper grounding is crucial. Attention must be given to decoupling the power supplies. Decoupling capacitors must be connected close to the device and between the power and ground pins to support high peak currents being drawn from system power rail during turn-on of the switching MOSFETs. Keep input and output traces as short as possible, because trace inductance, resistance, and capacitance can easily become the performance limiting items. The separate power pins VIN_Bx are not connected together internally. The VIN_Bx power connections shall be connected together outside the package using power plane construction.
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