ZHCSDS8E March 2015 – August 2021 TPS65982
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 说明（续）
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Supply Requirements and Characteristics
- 7.6 Power Supervisor Characteristics
- 7.7 Power Consumption Characteristics (1)
- 7.8 Cable Detection Characteristics
- 7.9 USB-PD Baseband Signal Requirements and Characteristics
- 7.10 USB-PD TX Driver Voltage Adjustment Parameter
- 7.11 Port Power Switch Characteristics
- 7.12 Port Data Multiplexer Switching Characteristics
- 7.13 Port Data Multiplexer Clamp Characteristics
- 7.14 Port Data Multiplexer SBU Detection Characteristics
- 7.15 Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
- 7.16 Port Data Multiplexer USB Endpoint Characteristics
- 7.17 Port Data Multiplexer BC1.2 Detection Characteristics
- 7.18 Analog-to-Digital Converter (ADC) Characteristics
- 7.19 Input/Output (I/O) Characteristics
- 7.20 I2C Slave Characteristics
- 7.21 SPI Controller Characteristics
- 7.22 BUSPOWERZ Configuration Characteristics
- 7.23 Thermal Shutdown Characteristics
- 7.24 Oscillator Characteristics
- 7.25 Single-Wire Debugger (SWD) Timing Requirements
- 7.26 HPD Timing Requirements
- 7.27 Typical Characteristics
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 USB-PD Physical Layer
- 9.3.2 Cable Plug and Orientation Detection
- 9.3.3
Port Power Switches
- 9.3.3.1 5V Power Delivery
- 9.3.3.2 5V Power Switch as a Source
- 9.3.3.3 PP_5V0 Current Sense
- 9.3.3.4 PP_5V0 Current Limit
- 9.3.3.5 Internal HV Power Delivery
- 9.3.3.6 Internal HV Power Switch as a Source
- 9.3.3.7 Internal HV Power Switch as a Sink
- 9.3.3.8 Internal HV Power Switch Current Sense
- 9.3.3.9 Internal HV Power Switch Current Limit
- 9.3.3.10 External HV Power Delivery
- 9.3.3.11 External HV Power Switch as a Source with RSENSE
- 9.3.3.12 External HV Power Switch as a Sink with RSENSE
- 9.3.3.13 External HV Power Switch as a Sink without RSENSE
- 9.3.3.14 External Current Sense
- 9.3.3.15 External Current Limit
- 9.3.3.16 Soft Start
- 9.3.3.17 BUSPOWERZ
- 9.3.3.18 Voltage Transitions on VBUS through Port Power Switches
- 9.3.3.19 HV Transition to PP_RV0 Pull-Down on VBUS
- 9.3.3.20 VBUS Transition to VSAFE0V
- 9.3.3.21 C_CC1 and C_CC2 Power Configuration and Power Delivery
- 9.3.3.22 PP_CABLE to C_CC1 and C_CC2 Switch Architecture
- 9.3.3.23 PP_CABLE to C_CC1 and C_CC2 Current Limit
- 9.3.4
USB Type-C Port Data Multiplexer
- 9.3.4.1 USB Top and Bottom Ports
- 9.3.4.2 Multiplexer Connection Orientation
- 9.3.4.3 Digital Crossbar Multiplexer
- 9.3.4.4 SBU Crossbar Multiplexer
- 9.3.4.5 Signal Monitoring and Pullup/Pulldown
- 9.3.4.6 Port Multiplexer Clamp
- 9.3.4.7 USB2.0 Low-Speed Endpoint
- 9.3.4.8 Battery Charger (BC1.2) Detection Block
- 9.3.4.9 BC1.2 Data Contact Detect
- 9.3.4.10 BC1.2 Primary and Secondary Detection
- 9.3.5 Power Management
- 9.3.6 Digital Core
- 9.3.7 USB-PD BMC Modem Interface
- 9.3.8 System Glue Logic
- 9.3.9 Power Reset Congrol Module (PRCM)
- 9.3.10 Interrupt Monitor
- 9.3.11 ADC Sense
- 9.3.12 UART
- 9.3.13 I2C Slave
- 9.3.14 SPI Controller
- 9.3.15 Single-Wire Debugger Interface
- 9.3.16 DisplayPort HPD Timers
- 9.3.17 ADC
- 9.3.18 I/O Buffers
- 9.3.19 Thermal Shutdown
- 9.3.20 Oscillators
- 9.4 Device Functional Modes
- 9.5 Programming
-
10Application and Implementation
- 10.1 Application Information
- 10.2
Typical Applications
- 10.2.1
Fully-Featured USB Type-C and PD Charger Application
- 10.2.1.1 Design Requirements
- 10.2.1.2
Detailed Design Procedure
- 10.2.1.2.1 TPS65982 External Flash
- 10.2.1.2.2 I2C (I2C), Debug Control (DEBUG_CTL), and Single-Wire De-bugger (SWD) Resistors
- 10.2.1.2.3 Oscillator (R_OSC) Resistor
- 10.2.1.2.4 VBUS Capacitor and Ferrite Bead
- 10.2.1.2.5 Soft Start (SS) Capacitor
- 10.2.1.2.6 USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
- 10.2.1.2.7 Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
- 10.2.1.2.8 Cable Connection (CCn) Capacitors and RPD_Gn Connections
- 10.2.1.2.9 LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VOUT_3V3, VIN_3V3, and VDDIO
- 10.2.1.3 Application Curve
- 10.2.2
Dual-Port Notebook Application Supporting USB PD Charging and DisplayPort
- 10.2.2.1 Design Requirements
- 10.2.2.2
Detailed Design Procedure
- 10.2.2.2.1 TPS65982 and System Controller Interaction
- 10.2.2.2.2 HD3SS460 Control and DisplayPort Configuration
- 10.2.2.2.3 9.3.2.3 DC Barrel Jack and Type-C PD Charging
- 10.2.2.2.4 Primary TPS65982 Flash Controller and Secondary Port
- 10.2.2.2.5 TPS65982 Dead Battery Support Primary and Secondary Port
- 10.2.2.2.6 Debugging Methods
- 10.2.2.3 Application Curves
- 10.2.1
Fully-Featured USB Type-C and PD Charger Application
- 11Power Supply Recommendations
-
12Layout
- 12.1
Layout Guidelines
- 12.1.1 TPS65982 Recommended Footprints
- 12.1.2 Alternate TPS65982 Footprint (Oval Pads)
- 12.1.3 Top TPS65982 Placement and Bottom Component Placement and Layout
- 12.1.4 Oval Pad Footprint Layout and Placement
- 12.1.5 Component Placement
- 12.1.6 Designs Rules and Guidance
- 12.1.7 Routing PP_HV, PP_EXT, PP_5V0, and VBUS
- 12.1.8 Routing Top and Bottom Passive Components
- 12.1.9 Void Via Placement
- 12.1.10 Top Layer Routing
- 12.1.11 Inner Signal Layer Routing
- 12.1.12 Bottom Layer Routing
- 12.2 Layout Example
- 12.1
Layout Guidelines
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
12.1.2 Alternate TPS65982 Footprint (Oval Pads)
Figure 12-3 shows the TPS65982 footprint using oval-shaped pads in specific locations. This allows the PCB designer to route the inner perimeter balls through the top layer. The balls around the perimeter have their pads in an oval shape with the exception of the corner balls. Figure 12-4 shows the sizing for the oval pads, 0.25 mm by 0.17 mm. All of the other non-oval shaped pads will have a 0.25 mm diameter. This footprint is recommended for MDI (Medium Density) PCB designs that are generally less expensive to build. The void under the TPS65982 allows for vias to route the inner signals and connect to the GND and power planes. Figure 12-5 shows the recommended minimum via size (8mil hole and 16 mil diameter). The recommended 8mil vias will be rated for approximately 1.8 A of DC current and 1.5 mΩ of resistance with 1.3 nH of inductance. Some board manufactures may offer 6mil hole and 12 mil diameter vias with a mechanical drill. This footprint is available for download on the TPS65982 product folder.
Figure 12-3 Top View Alternate TPS65982 Footprint (Oval Pads)
Figure 12-4 Oval Pad Sizing
Figure 12-5 Recommended Minimum Via Sizing