11.1 Layout Guidelines

The PCB layout of any DC-DC converter is critical to the optimal performance of the design. Bad PCB layout can disrupt the operation of an otherwise good schematic design. Even if the converter regulates correctly, bad PCB layout can mean the difference between a robust design and one that cannot be mass produced. Furthermore, the EMI performance of the regulator is dependent on the PCB layout, to a great extent. In a buck converter, the most critical PCB feature is the loop formed by the input capacitor and power ground, as shown in Figure 44. This loop carries fast transient currents that can cause large transient voltages when reacting with the trace inductance. These unwanted transient voltages will disrupt the proper operation of the converter. Because of this, the traces in this loop should be wide and short, and the loop area as small as possible to reduce the parasitic inductance. Figure 45 shows a recommended layout for the critical components of the LM53603-Q1. This PCB layout is a good guide for any specific application. The following important guidelines should also be followed:

1. Place the input capacitor(s) CIN as close as possible to the VIN and PGND terminals. VIN and GND are on the same side of the device, simplifying the input capacitor placement.
2. Place bypass capacitors for VCC and BIAS close to their respective pins. These components must be placed close to the device and routed with short/wide traces to the pins and ground. The trace from BIAS to VOUT should be ≥10mils wide.
3. Use wide traces for the CBOOT capacitor. CBOOT should be placed close to the device with short/wide traces to the CBOOT and SW pins.
4. Place the feedback divider as close as possible to the FB pin on the device. If a feedback divider and C_FF are used, they should be close to the device, while the length of the trace from V_OUT to the divider can be somewhat longer. However, this latter trace should not be routed near any noise sources that can capacitively couple to the FB input.
5. Use at least one ground plane in one of the middle layers. This plane will act as a noise shield and also act as a heat dissipation path.
6. Connect the EP pad to the GND plane. This pad acts as a heat-sink connection and a ground connection for the regulator. It must be solidly connected to a ground plane. The integrity of this connection has a direct bearing on the effective R_θJA.
7. Provide wide paths for VIN, VOUT and GND. Making these paths as wide as possible reduces any voltage drops on the input or output paths of the converter and maximizes efficiency.
8. Provide enough PCB area for proper heat-sinking. As stated in the Maximum Ambient Temperature section, enough copper area must be used to ensures a low R_θJA, commensurate with the maximum load current and ambient temperature. The top and bottom PCB layers should be made with two ounce copper; and no less than one ounce. Use an array of heat-sinking vias to connect the exposed pad (EP) to the ground plane on the bottom PCB layer. If the PCB has multiple copper layers (recommended), these thermal vias can also be connected to the inner layer heat-spreading ground planes.
9. Keep switch area small. The copper area connecting the SW pin to the inductor should be kept as short and wide as possible. At the same time the total area of this node should be minimized to help mitigate radiated EMI.
10. The resources in Table 7 provide additional important guidelines

Table 7. PCB Layout Resources

TITLE	LINK
AN-1149 Layout Guidelines for Switching Power Supplies	SNVA021
AN-1229 Simple Switcher PCB Layout Guidelines	SNVA054
Constructing Your Power Supply- Layout Considerations	SLUP230
SNVA721 Low Radiated EMI Layout Made SIMPLE with LM4360x and LM4600x	SNVA721

Figure 44. Current Loops with Fast Transients

11.2 Layout Example

Figure 45. PCB Layout Example