ZHCSEQ3D February   2016  – December 2022 LM5165

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Integrated Power MOSFETs
      2. 7.3.2  Selectable PFM or COT Mode Converter Operation
      3. 7.3.3  COT Mode Light-Load Operation
      4. 7.3.4  Low Dropout Operation and 100% Duty Cycle Mode
      5. 7.3.5  Adjustable Output Voltage (FB)
      6. 7.3.6  Adjustable Current Limit
      7. 7.3.7  Precision Enable (EN) and Hysteresis (HYS)
      8. 7.3.8  Power Good (PGOOD)
      9. 7.3.9  Configurable Soft Start (SS)
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode in COT
      4. 7.4.4 Active Mode in PFM
      5. 7.4.5 Sleep Mode in PFM
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Wide VIN, Low IQ COT Converter Rated at 5 V, 150 mA
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Switching Frequency – RT
          3. 8.2.1.2.3 Filter Inductor – LF
          4. 8.2.1.2.4 Output Capacitors – COUT
          5. 8.2.1.2.5 Series Ripple Resistor – RESR
          6. 8.2.1.2.6 Input Capacitor – CIN
          7. 8.2.1.2.7 Soft-Start Capacitor – CSS
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2: Small Solution Size PFM Converter Rated at 3.3 V, 50 mA
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Peak Current Limit Setting – RILIM
          2. 8.2.2.2.2 Switching Frequency – LF
          3. 8.2.2.2.3 Output Capacitor – COUT
          4. 8.2.2.2.4 Input Capacitor – CIN
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Design 3: High Density 12-V, 75-mA PFM Converter
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Peak Current Limit Setting – RILIM
          2. 8.2.3.2.2 Switching Frequency – LF
          3. 8.2.3.2.3 Input and Output Capacitors – CIN, COUT
          4. 8.2.3.2.4 Feedback Resistors – RFB1, RFB2
          5. 8.2.3.2.5 Undervoltage Lockout Setpoint – RUV1, RUV2, RHYS
          6. 8.2.3.2.6 Soft Start – CSS
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Design 4: 3.3-V, 150-mA COT Converter With High Efficiency
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Application Curves
      5. 8.2.5 Design 5: 15-V, 150-mA, 600-kHz COT Converter
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
          1. 8.2.5.2.1 COT Output Ripple Voltage Reduction
        3. 8.2.5.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Compact PCB Layout for EMI Reduction
        2. 8.4.1.2 Feedback Resistor Layout
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
      3. 9.1.3 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)LM5165UNIT
DRC (VSON)
10 PINS
RθJAJunction-to-ambient thermal resistance47.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance59.9°C/W
RθJBJunction-to-board thermal resistance22.1°C/W
ψJTJunction-to-top characterization parameter1°C/W
ψJBJunction-to-board characterization parameter22.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
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