ZHCSF41B December 2015 – March 2021 LMR16030
PRODUCTION DATA
PIN | TYPE (1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
BOOT | 1 | P | Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1-μF capacitor from BOOT to SW. |
VIN | 2 | P | Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible. |
EN | 3 | A | Enable pin with internal pullup current source. Pull below 1.2 V to disable. Float or connect to VIN to enable. Adjust the input undervoltage lockout with two resistors. See Section 7.3.6. |
RT/SYNC | 4 | A | Resistor Timing or External Clock input. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled and the operating mode returns to frequency programming by resistor. |
FB | 5 | A | Feedback input pin. Connect to the feedback divider to set VOUT. Do not short this pin to ground during operation. |
SS or PGOOD |
6 | A | SS pin for soft-start version. Connect to a capacitor to set
soft-start time. PGOOD pin for Power Good version, open drain output for power-good flag. Use a 10-kΩ to 100-kΩ pullup resistor to logic rail or other DC voltage no higher than 7 V. |
GND | 7 | G | System ground pin |
SW | 8 | P | Switching output of the regulator. Internally connected to high-side power MOSFET. Connect to power inductor. |
Thermal Pad | 9 | G | Major heat dissipation path of the die. Must be connected to ground plane on PCB. |