ZHCSFB7E
august 2016 – march 2023
TUSB546-DCI
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Supply Characteristics
6.6
DC Electrical Characteristics
6.7
AC Electrical Characteristics
6.8
Timing Requirements
6.9
Switching Characteristics
6.10
Typical Characteristics
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
USB 3.1
7.3.2
DisplayPort
7.3.3
4-Level Inputs
7.3.4
Receiver Linear Equalization
7.4
Device Functional Modes
7.4.1
Device Configuration in GPIO Mode
7.4.2
28
7.4.3
Device Configuration In I2C Mode
7.4.4
DisplayPort Mode
7.4.5
Linear EQ Configuration
7.4.6
USB3.1 Modes
7.4.7
Operation Timing – Power Up
7.5
Programming
7.6
Register Maps
7.6.1
General Register (address = 0x0A) [reset = 00000001]
7.6.2
DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
7.6.3
DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
7.6.4
DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
7.6.5
DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
7.6.6
USB3.1 Control/Status Registers (address = 0x20) [reset = 00000000]
7.6.7
USB3.1 Control/Status Registers (address = 0x21) [reset = 00000000]
7.6.8
USB3.1 Control/Status Registers (address = 0x22) [reset = 00000100]
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
System Examples
8.3.1
USB 3.1 Only
8.3.2
USB 3.1 and 2 Lanes of DisplayPort
8.3.3
DisplayPort Only
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.2
Layout Example
9
Device and Documentation Support
9.1
接收文档更新通知
9.2
支持资源
9.3
Trademarks
9.4
静电放电警告
9.5
术语表
10
Mechanical, Packaging, and Orderable Information
9.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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